A heating device to ensure the surface bonding rate

A heating device and bonding rate technology, which is applied to lighting and heating equipment, heat exchange equipment, heat exchanger shells, etc. , the problem of low fit rate, etc., to achieve the effect of simple structure, reasonable design, and guaranteed fit rate

Active Publication Date: 2015-08-05
DONGFENG MOTOR CORP HUBEI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the fluid heater arranges the heating unit in the radiator tank. Usually, due to the low bonding rate between the surface of the heating unit and the inner wall of the radiator tank, the heat transfer between the heating unit and the inner wall of the radiator tank Not effective enough to affect the thermal conductivity of the entire fluid heater

Method used

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  • A heating device to ensure the surface bonding rate
  • A heating device to ensure the surface bonding rate
  • A heating device to ensure the surface bonding rate

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Embodiment Construction

[0024] like figure 1 , 4 As shown, a heating device that ensures the surface bonding rate includes a radiator 2, a heating unit 3 installed in the radiator tank 4, and a wedge plate 1 arranged between the surface of the heating unit 3 and the wall of the radiator tank.

[0025] like figure 2 , 3 , 5, 6, and 7, the key point of the present invention is the design of the wedge plate and its matching structure with the heating unit and the radiator groove. In order to ensure the tight fit between the surface of the heating unit and the wall of the radiator groove, the draft angle 1.3 of the side surface of the wedge plate is the same as the draft angle 4.1 of the side surface of the radiator groove wall, and the width a of the upper surface of the wedge plate 1 is equal to The sum of the upper surface width c of the heating unit 3 is greater than the upper surface width e of the radiator groove 4, the sum of the lower surface width b of the wedge plate 1 and the lower surface...

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Abstract

The invention relates to a heating device for guaranteeing surface joint rate. The heating device comprises a radiator, a heating unit mounted in a radiator groove and a wedge-shaped plate arranged between the surface of the heating unit and the wall of the radiator groove. The sum of the width of the upper surface of the wedge-shaped plate and the width of the upper surface of the heating unit is larger than the width of the upper surface of the radiator groove; and the sum of the lower surface of the wedge-shaped plate and the width of the lower surface of the heating unit is larger than the width of the lower surface of the radiator groove. By the aid of the design of the wedge-shaped plate and matching structures between the wedge-shaped plate and the heating unit as well as between the wedge-shaped plate and the radiator groove, shaking of the heating unit in the radiator groove is prevented, and joint rate between the heating unit and the radiator groove is guaranteed, so that technical indexes such as high heat conductivity or electrical conductivity can be obtained. Besides, a groove and a through hole are formed on the wedge-shaped plate, and accordingly the wedge-shaped plate is pressed in the radiator groove and taken out of the radiator groove conveniently. The heating device is simple in structure, reasonable in design and good in heat conductivity.

Description

technical field [0001] The invention relates to a structure for ensuring close bonding between two or more surfaces, in particular to a heating device for ensuring the bonding rate of the surfaces. Background technique [0002] At present, the fluid heater arranges the heating unit in the radiator tank. Usually, due to the low bonding rate between the surface of the heating unit and the inner wall of the radiator tank, the heat transfer between the heating unit and the inner wall of the radiator tank The effect is not good, thereby affecting the thermal conductivity of the entire fluid heater. And the current traditional wedge-shaped board is used to strengthen, support or maintain fixed position fixtures. Contents of the invention [0003] The object of the present invention is to address the above-mentioned defects and provide a heating device that ensures the surface bonding rate. The setting of the wedge plate not only prevents the shaking of the heating unit in the h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28F9/00
Inventor 罗玉林孙西峰蔡文新贺其富邓雨来邱祥宇魏永盛
Owner DONGFENG MOTOR CORP HUBEI
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