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Aging Test Equipment

A technology of aging test and equipment, applied in the direction of single semiconductor device testing, measuring electricity, measuring equipment, etc., can solve the problems of reducing the processing speed and the response speed of semiconductor components, and achieve the effect of improving the processing speed and the response speed.

Active Publication Date: 2016-03-09
UNITEST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the past, if figure 1 As shown, the test signal transmitted from the test board through the connector is applied to the semiconductor element D mounted on each socket through the circuit C of the tree structure. At this time, the test signal becomes weak due to the radiation from the tree structure, which eventually leads to The response speed of the semiconductor element becomes slower, reducing the processing speed

Method used

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  • Aging Test Equipment
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Embodiment Construction

[0030] Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings. In order to make the description more concise, repeated descriptions or symbols of the same configuration will be omitted or compressed as much as possible.

[0031]

[0032] figure 2 A schematic structural diagram of an aging testing device 200 provided for an embodiment of the present invention.

[0033] Such as figure 2 As shown, the burn-in testing device 200 provided in this embodiment includes nine test boards 210 , a board storage chamber 220 , nine test substrates 230 , a substrate storage chamber 240 and the like.

[0034] Each of the nine test boards 210 is used to load semiconductor components to be tested, which will be described in more detail later.

[0035] The board storage chamber 220 is used to accommodate nine test boards 210 .

[0036] The nine test substrates 230 can be electrically connecte...

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PUM

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Abstract

A burn-in tester is provided. The disclosed technology is that a testing board at least arranges sockets belonging to a same column on one transmission line group; a fly-by structure is employed, so testing signals can be applied on selected semiconductor elements in sequence; and a testing base board generates strobe signals for accurately sampling from results signals returned by the semiconductor elements, thereby realizing accurate data sampling in high speed process.

Description

technical field [0001] The present invention relates to a test board of a burn-in tester (Burn-InTester) for testing the reliability of a semiconductor component against thermal stress when power is applied to the packaged semiconductor component and it is operated. Background technique [0002] Semiconductor elements undergo various tests after production, and the burn-in test related to the present invention is a test to confirm how much thermal stress the semiconductor element can withstand when an electrical signal is applied to the semiconductor element and operated. Moreover, the equipment that implements this aging test is the aging test equipment. [0003] The burn-in test equipment has a burn-in chamber and a test chamber, the burn-in chamber is used to accommodate semiconductor components, and the test chamber is used to read the result signal fed back after the test signal is applied to the semiconductor components accommodated in the burn-in chamber the test sub...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26H01L21/67
CPCG01R31/2855G01R31/2862G01R31/2863G01R31/2874G01R31/2884G01R31/2896
Inventor 李义元崔永培
Owner UNITEST