Connector

Abstract

The invention discloses a connector. The connector comprises an adhesive coating, through holes and electricity conduction devices; the through holes which are used for being penetrated through pins are formed in the adhesive coating; and the through holes are filled with the electricity conduction devices. The connector is also provided with a heat insulation layer which is arranged between the adhesive layer and a circuit board. The adhesive layer is combined with the heat insulation layer, and an integrated circuit and the circuit board are pressed in a matching mode to enable the integrated circuit, the connector and the circuit board to be in close contact. The electricity conduction devices are metal wires or conductive rubbers. According to the connector, the integrated circuit is directly connected with the circuit board in an insertion mode through the connector, bad phenomena such as insufficient soldering, cold soldering, bead welding, solder icicles and bridge connection are avoided when the circuit board and the integrated circuit are welded, the maintenance is convenient when the circuit is broke down, and pin looseness or pin bursting caused by overlong continuous utilization time of the integrated circuit are avoided.

Description

technical field [0001] The invention belongs to the technical field of integrated circuits, and in particular relates to a connector used for the connection between integrated circuits and circuit boards. Background technique [0002] At present, the connection between the integrated circuit and the circuit board is usually soldered, but there are often bad phenomena such as virtual soldering, false soldering, surfacing, solder tipping or bridging when soldering the pins. When the soldering temperature is too high, the chip will be burned out, resulting in The circuit board is not working properly. In addition, once the integrated circuit fails, it is troublesome to replace it. First, remove the original solder, pull out the components, replace the new components and then solder them. In this way, for highly integrated integrated circuits, it is easy to be damaged during repeated soldering. Internal organization of the chip. In addition, when the integrated circuit is used...

AI Technical Summary

Problems solved by technology

[0002] At present, the connection between the integrated circuit and the circuit board is usually soldered, but there are often bad phenomena such as virtual soldering, false soldering, surfacing, solder tipping or bridging when soldering the pins. When the soldering temperature is too high, the chip will be burned out, resulting in Circuit board not working properly

In addition, once the integrated circuit fails, it is troublesome to replace it. First, remove the original solder, pull out the components, replace the new components and then solder them. In this way, for highly integrated integrated circuits, it is easy to be damaged during repeated soldering. Chip Internal Organization

In addition, when the integrated circuit is used for a long time, it will generate a lot of heat, causing the solder to expand and contract with heat and cold, and the pins are easy to loosen or collapse, making the integrated circuit unable to operate normally.

Images