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Adhesion apparatus and adhesion method

A bonding device, display device technology, applied in lamination devices, chemical instruments and methods, lamination auxiliary operations, etc., can solve problems such as damage to the uniformity of bonding thickness, adhesive cushioning and viscosity loss, difficulties, etc. , to achieve uniform adhesive thickness and prevent overflow

Active Publication Date: 2013-09-25
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to secure enough spacers for blocking out of the field of view in the workpiece due to the requirement for larger screen size and smaller components themselves.
[0010] Also, for example, if the curing of the blocking adhesive is overly promoted, the cushioning and tack of the adhesive is lost
Therefore, when bonding, the upper and lower workpieces are not coordinated, which may damage the uniformity of the bonded thickness.

Method used

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  • Adhesion apparatus and adhesion method
  • Adhesion apparatus and adhesion method
  • Adhesion apparatus and adhesion method

Examples

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Embodiment Construction

[0038] Embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.

[0039] [A. Composition]

[0040] First, the configuration of the adhesive supply device (hereinafter referred to as the present device) of the present embodiment will be described. This device is figure 1 as well as figure 2 As shown, it has an adhesive supply part 1, a bonding part 2, and the like. The workpiece S1 to be bonded is provided so as to be movable between the adhesive supply part 1 and the bonding part 2 by the conveyance part 3 .

[0041] As the adhesive used in the present embodiment, for example, an ultraviolet (UV) curable resin may be used. Adhesive supply part 1 such as figure 1 Shown is a supply section 10, an irradiation section 11, and the like. The supply unit 10 includes, for example, a dispenser that drips the adhesive R stored in the tank T onto the workpiece S1 via a pipe. The dispenser is confi...

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PUM

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Abstract

The invention provides an adhesion apparatus and an adhesion method, wherein overflow due to adhesive flow can be prevented and a uniform adhesion thickness can be ensured with the apparatus. The adhesion apparatus adopts an ultraviolet-curable adhesive R to adhere a work-piece S1 and a work-piece S2, wherein the S1 and the S2 form a liquid crystal display. The apparatus comprises: a supply part (10) for providing the adhesive R so as to distribute the adhesive R all over the whole single surface of at least the one work-piece S1, an irradiation part (11) for irradiating UV on the whole adhesive R distributed all over the whole single surface of the work-piece S1 in atmosphere before adhesion so as to temporarily cure, and an adhesion part (2) for adhering the other work-piece S2 on the temporarily cured adhesive.

Description

technical field [0001] The present invention relates to, for example, an improved bonding apparatus and bonding method for the technique of supplying an adhesive to the workpieces for bonding a pair of workpieces constituting a display device. Background technique [0002] Generally, a liquid crystal display is constituted by laminating a liquid crystal module, a touch panel for operation, a protective plate (cover plate) for protecting the surface, and the like. These liquid crystal modules, touch panels, protective panels, and the like (hereinafter referred to as workpieces) are assembled into a casing of a liquid crystal display. [0003] In the bonding of such workpieces, there are methods using an adhesive sheet and a method using a resin adhesive. An adhesive sheet is more expensive than an adhesive, and requires steps such as peeling of a release paper. Therefore, bonding using an adhesive has become mainstream in response to demands such as cost reduction in recent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B32B38/16G02F1/1333
Inventor 成田悠
Owner SHIBAURA MECHATRONICS CORP
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