Adhesion apparatus and adhesion method
A bonding device, display device technology, applied in lamination devices, chemical instruments and methods, lamination auxiliary operations, etc., can solve problems such as damage to the uniformity of bonding thickness, adhesive cushioning and viscosity loss, difficulties, etc. , to achieve uniform adhesive thickness and prevent overflow
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[0038] Embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.
[0039] [A. Composition]
[0040] First, the configuration of the adhesive supply device (hereinafter referred to as the present device) of the present embodiment will be described. This device is figure 1 as well as figure 2 As shown, it has an adhesive supply part 1, a bonding part 2, and the like. The workpiece S1 to be bonded is provided so as to be movable between the adhesive supply part 1 and the bonding part 2 by the conveyance part 3 .
[0041] As the adhesive used in the present embodiment, for example, an ultraviolet (UV) curable resin may be used. Adhesive supply part 1 such as figure 1 Shown is a supply section 10, an irradiation section 11, and the like. The supply unit 10 includes, for example, a dispenser that drips the adhesive R stored in the tank T onto the workpiece S1 via a pipe. The dispenser is confi...
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