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Electronic device and heat dissipation apparatus thereof

A heat dissipation device and electronic device technology, applied in the direction of electrical components, electrical digital data processing, electrical equipment structural components, etc., can solve the problems of increased overall power consumption, weakened heat dissipation capacity of radiators, and inability of processors to fully exert their performance. To achieve the effect of solving the heat dissipation problem

Inactive Publication Date: 2013-10-23
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, the design space reserved for the heat sink is decreasing, causing the heat dissipation capability of the heat sink to be correspondingly weakened, which in turn causes the processor in the electronic device to be unable to fully exert its performance due to limited heat dissipation. It must also be maintained at a higher speed, and the overall power consumption will also increase

Method used

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  • Electronic device and heat dissipation apparatus thereof
  • Electronic device and heat dissipation apparatus thereof
  • Electronic device and heat dissipation apparatus thereof

Examples

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Embodiment Construction

[0015] Please refer to figure 1 and figure 2 , The electronic device according to an embodiment of the present invention includes a metal casing 70 , a heat dissipation device and a circuit board 60 placed in the metal casing 70 . The heat dissipation device is used to dissipate heat from the heat-generating electronic components 62 on the circuit board 60 , and includes a heat sink and a cover 50 covering the heat sink.

[0016] The metal casing 70 includes a bottom plate 72 , a pair of side walls 74 vertically extending upward along the outer edge of the bottom plate 72 , and a cover plate 76 connected to the side walls 74 . The cover plate 76 , the side wall 74 and the bottom plate 72 together form a cavity 78 for accommodating the heat sink and the circuit board 60 . The circuit board 60 is disposed close to the bottom plate 72 of the metal casing 70 .

[0017] Please also refer to Figure 3 to Figure 5 The radiator includes a heat conducting plate 10, a heat absorbin...

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Abstract

A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and plural of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for cooling an electronic device. Background technique [0002] Nowadays, the design of electronic devices such as computers and servers (such as various blade servers) is developing in the direction of high performance and thinness. In the limited housing space of electronic devices, more electronic modules and various components to serve more and faster data processing functions. As a result, the design space reserved for the heat sink is decreasing, causing the heat dissipation capacity of the heat sink to be correspondingly weakened, which in turn causes the processor in the electronic device to be unable to fully exert its performance due to the limited heat dissipation problem, and the heat dissipation fan It must also be maintained to run at a higher speed, and the overall power consumption is also increased. Contents of the invention [0003] In v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2049G06F1/20
Inventor 秦际云
Owner FU ZHUN PRECISION IND SHENZHEN
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