Camera module, manufacturing method thereof, and handheld communication device using the camera module

Abstract

A camera module, comprising: a base having a first open end and a second open end opposite to the first open end; a circuit board covering the second open end, including a sequentially stacked substrate, a conductive layer and a solder mask layer, the size of the solder resist layer and the conductive layer is less than or equal to the size of the substrate, and the periphery of the solder resist layer and the conductive layer is at a distance from the corresponding periphery of the substrate; the material of the second opening end and the substrate is thermoplastic, and the substrate The molecular structure of the material is the same as or similar to the molecular structure of the material at the second opening end; wherein, the wall thickness of the second opening end is smaller than the distance between the periphery of the solder resist layer and the conductive layer and the periphery of the substrate, and the second opening end is directly connected to the substrate Edge regions of surfaces opposite to the second open end are ultrasonically welded together. The tilting error of the above-mentioned camera module is small, and the manufacture is relatively clean and convenient. The invention also provides a manufacturing method of the camera module and a handheld communication device using the camera module.

Description

【Technical field】 [0001] The invention relates to an image acquisition device, in particular to a camera module, a manufacturing method thereof, and a handheld communication device using the camera module. 【Background technique】 [0002] In the traditional technology, the connecting plate of the cell-phone camera module 10 (CCM, cell-phone camera module) and the base 11 are fixedly connected by glue. Such as figure 1 As shown, the connection plate is a double-sided circuit board as an example. The substrate 12a of the double-sided circuit board 12 is an FR4 epoxy resin cloth laminated board, both sides are plated with copper 12b, and the outer surface is covered with an ink layer 12c (coverlay). Glue 13 is coated between the base 11 and the ink layer 12c to securely connect the base 11 and the circuit board 12 . [0003] However, traditional camera modules have the following defects: [0004] (1) Since the glue 13 is colloidal body with certain fluidity, a small amount of...

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Problems solved by technology

[0004] (1) Since the glue 13 is a colloidal body with certain fluidity, a small amount of glue 13 will overflow after pressing the base 11, which will easily pollute the camera module and affect the shooting effect of the camera module

[0005] (2) There is a certain thickness after the glue 13 dries up, and there are differences in the amount of glue applied. After the base 11 and the circuit board 12 are fixed with the glue 13, the inclination error of the base 11 relative to the circuit board 12 is relatively large. The effect has a great impact, especially for high-resolution camera modules

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