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Method for manufacturing waterproof sheets of microphones

A manufacturing method and microphone technology, which is applied in the field of microphones, can solve the problems of insufficient mass production of thin slices, high-temperature reflow resistance of thin slices, and insufficient small mesh of thin slices, etc., and achieve good structural integrity, which is conducive to mass production and packaging Effect

Inactive Publication Date: 2013-11-13
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of the waterproof fine-mesh sheets used in existing microphones are that some sheets are not small enough in mesh, some are not thick enough, some are not resistant to high temperature reflow, and most sheets are not mass-producible enough.

Method used

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  • Method for manufacturing waterproof sheets of microphones
  • Method for manufacturing waterproof sheets of microphones
  • Method for manufacturing waterproof sheets of microphones

Examples

Experimental program
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Effect test

no. 1 example

[0027] Figures 4a-4e is a sectional view showing a method of manufacturing the microphone waterproof sheet according to the first embodiment of the present invention. First, if Figure 4a As shown, a thin silicon wafer 100 is prepared. The thickness of the thin silicon wafer 100 can be in the range of about 50 μm to about 150 μm, so that the thin silicon wafer 100 has sufficient mechanical strength, and through holes can also be directly formed by etching, as described later. The thin silicon wafer 100 can be obtained from a silicon wafer supplier, or can be obtained by thinning an ordinary thick silicon wafer (with a thickness ranging from about 400 μm to about 1200 μm).

[0028] Next, if Figure 4b As shown, the thin silicon wafer 100 is fixed on the etching carrier 300 by the double-sided adhesive tape 200 . The etching carrier 300 can be a thick silicon wafer, a ceramic substrate, a glass substrate or a metal substrate. Since the thin silicon wafer 100 is too thin, i...

no. 2 example

[0034]In the manufacturing method of the microphone waterproof sheet according to the second embodiment of the present invention, except for the step of fixing the thin silicon wafer on the etching carrier, other steps are the same as those described in the first embodiment. Figure 6 is a cross-sectional view showing the method for fixing a thin silicon wafer on an etching carrier according to the second embodiment of the present invention. Such as Figure 6 As shown, after the thin silicon wafer 100 is prepared, the thin silicon wafer 100 is fixed on the etching carrier 300 by a clamp 200 or a single-sided adhesive tape.

no. 3 example

[0036] In the manufacturing method of the microphone waterproof sheet according to the third embodiment of the present invention, except for the step of fixing the thin silicon wafer on the etching carrier, other steps are the same as those described in the first embodiment. Figure 7 is a cross-sectional view showing the method for fixing a thin silicon wafer on an etching carrier according to the third embodiment of the present invention. Such as Figure 7 As shown, after the thin silicon wafer 100 is prepared, the thin silicon wafer 100 is fixed on the etching carrier 300 by bonding.

[0037] Specifically, a bonding layer 202 that can be bonded to the silicon wafer is formed on the etching carrier 300, and then the thin silicon wafer 100 is bonded to the bonding layer 202 through a hydrophilic bonding or a hydrophobic bonding mechanism. , so that the thin silicon wafer 100 is fixed on the etching carrier 300 . After forming a plurality of water non-immersion through holes...

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Abstract

The invention provides a method for manufacturing waterproof sheets of microphones. The method comprises the steps of a) fixing thin silicon wafers on etching carriers; b) forming a plurality of water-impermeable through holes on the thin silicon wafers through etching. The waterproof sheets of the microphones, which are manufactured according to the method, are good in structural integrity, good in waterproof performance, good in sound effect, thin and accurate in thickness, resistant to high-temperature backflows and good in batch productivity.

Description

technical field [0001] The invention relates to the technical field of microphones, in particular to a method for manufacturing a microphone waterproof sheet. Background technique [0002] Today, microphones on many electronic products (eg, cell phones, cameras, wrist phones, etc.) are required to be waterproof. The commonly used microphone waterproof method is to paste a fine mesh sheet at the sound hole of the microphone, so that sound waves can still pass through the fine mesh sheet to reach the diaphragm inside the microphone, while water cannot pass through the fine mesh due to surface tension. The flakes go into the inside of the microphone, so that the microphone is waterproof, and it can also achieve dust reduction. [0003] figure 1 and figure 2 is a schematic cross-sectional view showing the structures of two existing waterproof MEMS microphones. Such as figure 1 and figure 2 As shown, in the existing two MEMS microphones with waterproof function, the silic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R31/00
Inventor 蔡孟锦
Owner GOERTEK INC
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