Probe Station Rotary Lifting Mechanism

Abstract

A rotary lifting mechanism for a probe station comprises a lifting control apparatus, a rotary control device and a wafer bearing stage. A rotary shaft of a lifting motor of the lifting control apparatus is fixedly connected with one end of a lifting screw through a coupler, an internal thread rollway is arranged on a lifting nut, an external thread rollway matched with the internal thread rollway is arranged on the lifting screw, the lifting nut is sleeved on the lifting screw, a ball spline lifting rod is fixedly connected with the lifting nut, one end of the ball spline lifting rod, which is far away from the lifting motor, is fixedly connected with the wafer bearing stage, and the ball spline lifting rod is mounted in a ball spline seat. The wafer bearing stage is fixed on the rotary control device, and the wafer bearing stage and the rotary control device serving as a whole are fixed on the lifting control apparatus. According to the rotary lifting mechanism, a ball spline pair formed by the ball spline seat and the ball spline lifting rod is a member performing linear motion and has high linear motion straightness, and the thread contact between the lifting nut and the lifting screw is tight.

Description

technical field [0001] The invention relates to the field of semiconductor performance testing instruments, in particular to a probe station rotating and lifting mechanism. Background technique [0002] The probe station is a semi-automatic mechanical device that tests the wafer circuit in the semiconductor front-end processing technology, marks the test results and collects signals. The rotary lifting mechanism is one of the core functional mechanisms of the probe station. [0003] The traditional rotary lifting mechanism uses the motor I as the power source, and the motor I drives the belt to connect the ball screw, changing from the original rotating pair to the up and down motion pair, so that the film carrier can move up and down. The motor Ⅱ drives the belt to connect the rotating mandrel to do the rotating motion. Under the transmission of the ball screw, the rotating device rises and falls together, thus forming a rotating lifting mechanism. The wafer is picked up...

AI Technical Summary

Problems solved by technology

[0004] However, the traditional rotary lifting mechanism often has uneven flatness during the test process, requiring frequent calibration and calibration. The Z-axis repeat positioning accuracy is prone to deviations at the same time as the speed is fast, and the test results are fed back on the wafer. Shallow, there are problems such as test instability

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