Method for positioning angle of wafer ring assembly and mechanism for implementing the method

Abstract

The invention relates to a method for positioning a wafer ring assembly and a mechanism for implementing the method, wherein the method comprises the following steps of: (a) arranging a non-transparent positioning tap on a light-transparent film of the wafer ring assembly; (b) making the wafer ring assembly rotate along a rotating center for making the positioning tag rotatably pass through a sensing position of an opto-sensor; and (c) after the opto-sensor detects that the positioning tag passes through the sensing position of the opto-sensor, making the wafer ring assembly be stopped at a target position after again rotating a preset angle alpha, so as to complete angle positioning of the wafer ring assembly. Secondary, a bar code tag attached on the film can be used as the positioning tag, the bar code can be read while the wafer ring assembly is positioned.

Description

technical field [0001] The present invention is related to the semiconductor testing industry, in particular to a method for angular positioning of a wafer carrier ring assembly comprising a ring, a film stretched in the ring, and a wafer attached to the film, and The institution used to implement the method. Background technique [0002] In the current inspection of semiconductors, there is a situation in which the die on a wafer carrier ring assembly is inspected. The aforementioned wafer carrier ring assembly usually includes a ring such as an expander ring (expender ring) , a light-permeable film such as blue film (blue tape) and the periphery fixed to the ring so as to stretch itself in the ring, a wafer attached to the film and having a plurality of crystal grains, And a barcode label that records specific data and is pasted on the film. Before the aforementioned wafer carrier ring assembly is delivered to the inspection machine for inspection, the following previous...

AI Technical Summary

Problems solved by technology

This method can avoid the steps of barcode reading and pre-positioning of the wafer carrier ring assembly in advance. However, this method will make the work platform with precise positioning function must have the function of 360-degree rotation, so that the machine The design and construction costs are relatively high, and if the grain to be inspected has a symmetrical image, image recognition is prone to failure or time-consuming

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