Electronic component mounting apparatus

Abstract

The present invention provides an electronic component mounting apparatus based on the replacement of the common nozzle of the adsorption suppressing increase in size and production cost of the entire device. In the substrate for mounting an electronic component (B) on the electronic component mounting apparatus (1) comprising: a plurality of substrate transfer unit (3F, 3R), it will transport the substrate (B) is arranged parallel to the substrate conveyor line; more mounting head (5F, 5R), which is detachably attached to the electronic component for attracting and holding the adsorption nozzle (N), is set to, can be adsorbed by the suction nozzle (N) to the adsorption of the electronic component held by the substrate transfer unit (3F, 3R) mounted substrate moves; replacement unit and multiple nozzle (7), which is disposed between the substrate conveying portion (3F, 3R), can be placed in different types of adsorbing and holding the electronic components were replaced with a adsorption nozzle (N).

Description

technical field [0001] The present invention relates to an electronic component mounting device that holds an electronic component with a suction nozzle, moves the electronic component, and mounts the electronic component on a substrate. Background technique [0002] Generally, an electronic component mounting apparatus for mounting electronic components on a substrate includes a mounting head having a suction nozzle for holding the electronic component by the suction nozzle and mounting the electronic component on the substrate. The electronic component mounting apparatus moves the suction nozzle of the mounting head in a direction perpendicular to the surface of the substrate to suction the components located in the electronic component supply section, and then makes the mounting head face to face in a direction parallel to the surface of the substrate. to move. Then, after reaching the mounting position of the suctioned component, the suction nozzle of the mounting head ...

AI Technical Summary

Problems solved by technology

[0009] However, as shown in Patent Document 1, in an electronic component mounting apparatus in which each nozzle replacement section is provided corresponding to each mounting head corresponding to each substrate conveying section, it is necessary to direct the mounting head to the side opposite to each substrate conveying section. Nozzle replacement part movement

Therefore, the moving area of ​​the mounting head is greatly expanded, the efficiency of mounting electronic components on the substrate is deteriorated, and the production cost is increased.

In addition, in the case of an electronic component mounting apparatus in which the mounting head is not moved to the nozzle changer on the opposite side across each substrate conveyance unit, and the moving area of ​​the mounting head is not enlarged, the operating apparatus must be temporarily stopped. The operator manually moves the suction nozzle to each nozzle replacement part

Therefore, also in such an electronic component mounting apparatus, the efficiency of mounting electronic components on the substrate is deteriorated, and the production cost increases.

Images