Unlock instant, AI-driven research and patent intelligence for your innovation.

Array substrate, display device and method for manufacturing array substrate

A technology of array substrate and metal connection part, which is applied in the field of liquid crystal display, can solve the problems of increased resistance, long distance, easy breakage of ITO6, etc., and achieve the effect of reducing the generation of slope

Active Publication Date: 2013-12-11
BOE TECH GRP CO LTD +1
View PDF7 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The array substrate includes a base substrate 1, and a gate metal connection part 2, a first insulating layer 3, a source / drain metal connection part 4, and a second insulating layer 5 are sequentially formed on the base substrate 1, and it is necessary to connect the Gate (gate metal Connection part) and SD (source / drain metal connection part) metal, the first via hole 7 and the second via hole 8 will be provided on the Gate and SD metal respectively to remove the first insulating layer 3 and the second via hole above the gate metal connection part The second insulating layer 5, and the second insulating layer 5 above the source / drain metal connection part 4 is removed, and then connected with ITO (transparent conductive film layer) 6, such as figure 1 As shown, due to the slope angle of the via hole and the level difference in the insulating layer, and the distance between the gate metal connection part 2 and the source / drain metal connection part 4 is relatively long, the distance between the gate metal connection part 2 and the source / drain metal connection part 4 There are multiple slope structures in the ITO6 between them, which increases the resistance between the gate metal connection part 2 and the source / drain metal connection part 4, and the ITO6 is prone to breakage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate, display device and method for manufacturing array substrate
  • Array substrate, display device and method for manufacturing array substrate
  • Array substrate, display device and method for manufacturing array substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] The structure and principle of the present invention will be described in detail below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, not to limit the protection scope of the present invention.

[0036] Such as figure 2 As shown, this embodiment provides an array substrate, including: the first metal connection part 2 and the second metal connection part 4 located in different layers, and also includes a The transparent conductive film layer 6 of part 4;

[0037] The first metal part 2 and the second metal connection part 4 are separated by the first insulating layer 3; the first metal connection part 2 and the second metal connection part 4 are arranged in a direction perpendicular to the plane of the array substrate overlap at least partially.

[0038] In this embodiment, the first metal connection part and the second metal connection part at least partially overlap in a direction perpendicular ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an array substrate, a display device and a method for manufacturing the array substrate. The array substrate comprises a first metal connecting portion and a second metal connecting portion, wherein the first metal connecting portion and the second metal connecting portion are located in different layers. The array substrate further comprises a transparent conductive film layer used for connecting the first metal connecting portion and the second metal connecting portion. The first metal connecting portion is separated form the second metal connecting portion through a first insulating layer, and the first metal connecting portion and the second metal connecting portion are at least partly overlapped in the direction perpendicular to the plane where the array substrate is located. The array substrate, the display device and the method for manufacturing the array substrate have the advantages that the first metal connecting portion and the second metal connecting portion are at least partly overlapped in the direction perpendicular to the plane where the array substrate is located, the distance from the transparent conductive film layer used for connecting the first metal connecting portion and the second metal connecting portion to the array substrate in the parallel direction is greatly shortened, the size of the contact resistance when the transparent conductive film layer makes contact with the first metal connecting portion and the second metal connecting portion is reduced, and the generation of a transparent conductive film layer slope is avoided.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to an array substrate, a display device and a method for manufacturing the array substrate. Background technique [0002] The array substrate includes a base substrate 1, and a gate metal connection part 2, a first insulating layer 3, a source / drain metal connection part 4, and a second insulating layer 5 are sequentially formed on the base substrate 1, and it is necessary to connect the Gate (gate metal Connection part) and SD (source / drain metal connection part) metal, the first via hole 7 and the second via hole 8 will be provided on the Gate and SD metal respectively to remove the first insulating layer 3 and the second via hole above the gate metal connection part The second insulating layer 5, and the second insulating layer 5 above the source / drain metal connection part 4 is removed, and then connected with ITO (transparent conductive film layer) 6, such as fi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1362G02F1/1368H01L23/50
CPCH01L27/124
Inventor 马禹
Owner BOE TECH GRP CO LTD