Encapsulation structure of wire winding type electronic device and chip inductor

A technology of electronic devices and packaging structures, applied in the direction of transformer/inductor core, transformer/inductor coil/winding/connection, inductor with magnetic core, etc. Defective rate and other issues

Active Publication Date: 2013-12-11
SHENZHEN ZHENHUA FU ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Wire-wound electronic devices with traditional structures, especially wire-wound chip inductors with traditional structures, are easily damaged during operation, and the paint film of the enamelled copper wire is easily damaged, and the solder joints on the coil lead-out wires and terminal electrodes are easily damaged, and some even It will fall off and break the wire, resulting in a high defect rate and low reliability of the product

Method used

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  • Encapsulation structure of wire winding type electronic device and chip inductor
  • Encapsulation structure of wire winding type electronic device and chip inductor
  • Encapsulation structure of wire winding type electronic device and chip inductor

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Embodiment Construction

[0018] The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0019] figure 1 It is a side view of the packaging structure of a traditional wirewound chip inductor. Since the packaging glue 130 only covers part of the coil, the exposed coil is not effectively protected, and there are gaps 140 and 150 between the coil lead wire and the inductor core. Coil lead wires are not protected by encapsulant.

[0020] figure 2 It is a side view of the packaging structure of the wire-wound chip inductor according to an embodiment of the present invention, image 3 for figure 2 Bottom view of package structure of the shown wirewound chip inductor.

[0021] refer to figure 2 and image 3 , The packaging structure of the wirewound chip inductor in this embodiment includes an inductor core 110 , a coil 120 and a packaging glue 130 . The encapsulant 130 is made of UV curable resin (UV Curable Res...

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Abstract

The invention relates to an encapsulation structure of a wire winding type electronic device. Compared with a traditional encapsulation structure of the wire winding type electronic device, and particularly compared with a traditional wire winding type chip inductor, the encapsulation structure has the improvement that a coil is completely covered by encapsulation glue, and in addition, the encapsulation glue is also filled in a gap between a coil leading-out wire and an inductor core body. By the structure, the defects that a coil enamelled copper wire paint film of the traditional wire winding type chip inductor is damaged, end electrode welding spots are damaged, and the like are greatly overcome.

Description

technical field [0001] The invention relates to a package structure of electronic devices, in particular to a package structure of wire-wound electronic devices. Background technique [0002] Wire-wound electronic devices with traditional structure, especially wire-wound chip inductors with traditional structure, are easily damaged during operation, and the paint film of the enamelled copper wire is easily damaged, and the solder joints on the coil lead-out wire and the terminal electrode are easily damaged, and some even It will fall off and disconnect, resulting in a higher defect rate and lower reliability of the product. Contents of the invention [0003] Based on this, it is necessary to provide a packaging structure for wire-wound electronic devices that can protect enameled copper wires and solder joints of terminal electrodes, and improve product yield and reliability. [0004] A packaging structure of a wire-wound electronic device, comprising a wire-wound base b...

Claims

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Application Information

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IPC IPC(8): H01F17/04H01F27/28H01F27/24H01F27/29
Inventor 康武闯李建辉樊应县高永毅陈益芳王智会
Owner SHENZHEN ZHENHUA FU ELECTRONICS
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