Integrated package structure and package method of surface acoustic wave filter

Abstract

The invention relates to an integrated packaging structure of a surface acoustic wave filter and a packaging method thereof, belonging to the technical field of surface acoustic wave. It includes a surface acoustic wave filter chip, a matching tuning circuit and a packaging shell. The packaging shell is composed of a packaging base, outer pins of the packaging base, and a sealing cap. The sealing cap covers the packaging base. The tuning circuit is made on the tuning substrate, the surface acoustic wave filter chip is bonded on the tuning substrate, and is electrically connected to the matching tuning circuit through the bonding wire; the tuning substrate is bonded to the package base, and the bonding wire is connected to the package base The external pins are electrically connected. The invention integrates the surface acoustic wave filter chip and the matching tuning circuit into the same package body, simplifies the interconnection structure between the surface acoustic wave filter chip, the matching tuning circuit and the application circuit, and has the advantages of compact structure, small loss, and Strong interference ability and other advantages help to improve the overall performance of the surface acoustic wave filter application system.

Description

technical field [0001] The invention relates to an electronic packaging structure and packaging method, in particular to an integrated packaging structure and packaging method of a surface acoustic wave filter, belonging to the technical field of surface acoustic wave. Background technique [0002] When the surface acoustic wave filter is connected to the application circuit, it is often necessary to set a tuning circuit between it and the front and rear circuits to achieve the matching of the electrical parameters between the device and the front and rear circuits, so as to exert the best performance of the surface acoustic wave filter. performance. The surface acoustic wave filter in the prior art generally adopts an independent packaging method, that is, each filter chip is placed in a package shell separately, and the matching tuning circuit is arranged outside the device package. The disadvantages brought about by this are The structure of the interconnection between t...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome above-mentioned deficiencies in the prior art, overcome the surface acoustic wave filter chip and the matching tuner circuit in the prior art to separate inside and outside the package, the interconnection wire structure is complex, the loss is large, and the anti-interference ability is poor, and then The shortcomings that have a significant adverse effect on the overall performance of the surface acoustic wave filter application system, thereby providing an integrated packaging structure and packaging method for the surface acoustic wave filter

Images