Panel cutting device and method of conveying panel in the same

A breaking device and substrate conveying technology, which is applied to glass cutting devices, conveyor objects, transportation and packaging, etc., to prevent scars or damage, prevent glass debris, and improve processing efficiency

Active Publication Date: 2013-12-18
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] The object of the present invention is to provide a substrate cutting device and a substrate that can prevent the problem of end material falling or substrate cracking caused by the transfer of the transfer device, and can transfer the scribed substrate to the next stage without causing damage. Transport method

Method used

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  • Panel cutting device and method of conveying panel in the same
  • Panel cutting device and method of conveying panel in the same
  • Panel cutting device and method of conveying panel in the same

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Embodiment Construction

[0061] In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose of the invention, the following is a specific description of a substrate breaking device and a substrate conveying method of the substrate breaking device according to the present invention in conjunction with the accompanying drawings and preferred embodiments. Embodiments, structures, features and effects thereof are described in detail below.

[0062] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention can be embodied in various forms, and is not limited to the embodiments described here. In the drawings, in order to describe the present invention simply and clearly, parts irrelevant to the description are omitted, and the same reference signs are attached to the same or similar constituent elements throughout the specification. In addition, in the embodim...

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Abstract

The invention discloses a panel cutting device and a method of conveying a panel in the same capable of preventing the substrate from falling or fracturing during the weight shifting of the substrate. The substrate cutting device comprises a first conveying part and a second conveying part, which are disposed at an interval along the conveying direction, namely the first direction, and are provided with a band part coiled on a plurality of rollers during the carrying of the substrate; an engraving unit disposed on the interval; a jumping roller unit, which is disposed on the upstream side second conveying part and the downstream side second conveying part, and is provided with at least a first roller and a second roller. The first roller is disposed on an outer side of the second conveying part, and the second roller is disposed on an inner side of the second conveying part. The first roller and the second roller can move in opposite directions in the second direction crossed with the first direction. The invention also provides a method of conveying panel in the same.

Description

technical field [0001] The present invention relates to a substrate cutting device and a substrate conveying method of the substrate cutting device for cutting and conveying mother substrates of various materials including glass substrates used in display panels such as liquid crystal display devices. A substrate breaking device and a substrate conveying method capable of conveying a scribed and divided brittle material substrate in a good state without causing damage when the substrate is conveyed to the next stage. Background technique [0002] Generally, a display panel such as a liquid crystal display device is usually formed using a brittle material substrate, that is, a glass substrate. In the liquid crystal display device, a pair of glass substrates are bonded with an appropriate interval therebetween, and a liquid crystal is sealed in the interval to form a display panel. When such a display panel is manufactured, the bonded mother substrate to which the mother glas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/02C03B35/00
CPCB26F3/00B65G49/061C03B33/03C03B33/037G02F1/1303G02F1/1313
Inventor 西尾仁孝
Owner MITSUBOSHI DIAMOND IND CO LTD
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