Detection device for detecting liquid crystal module

Abstract

The invention discloses a detection device for detecting a liquid crystal module. The detection device comprises a top board and an overturning assembly, wherein the top board comprises a first top board and a second top board; the first top board is used for placing a module to be detected; the overturning assembly is arranged on the second top board in a turnover manner and comprises a first detection substrate, a first substrate fixing plate, a second detection substrate and a second substrate fixing plate; the first substrate fixing plate is used for fixing the first detection substrate; the second substrate fixing plate is used for fixing the second detection substrate; a first connector detection port which is used for detecting a connector of the module to be detected is formed in the first detection substrate; a second connector detection port which is used for detecting the connector of the module to be detected is formed in the second detection substrate. In the operation process of the device, the module to be detected is convenient to replace, the damage rate of a connector port in the module to be detected is reduced, the service life of the connector detection ports in the detection substrates is prolonged, and the production efficiency is effectively improved.

Description

technical field [0001] The invention relates to a detection device, in particular to a detection device for liquid crystal module detection. Background technique [0002] Existing liquid crystal module testing fixtures are processed and assembled from black bakelite, sheet metal parts, fixtures, PCB boards, electronic components and various signal lines. It adopts a complete contact method in the detection process, that is, the connector port on the module to be tested is completely pressed into the connector detection port on the contact detection substrate. For products with multiple connector ports, the conduction detection method is also used to detect the crimping of the ports one by one. The existing method mainly has the following two disadvantages: 1. The detection speed is slow and the production efficiency is low; 2. The connector port on the module to be tested and the connector detection port on the detection substrate are easily damaged, which increases the pro...

AI Technical Summary

Problems solved by technology

The existing method mainly has the following two disadvantages: 1. The detection speed is slow and the production efficiency is low; 2. The connector port on the module to be tested and the connector detection port on the detection substrate are easily damaged, which increases the product defect rate , leading to an increase in production costs

When testing, the connector on the product side is directly buckled on the connector on the contact substrate, and it needs to be completely pressed in, because the connector is relatively small, and the alignment crimping is very difficult to align, and it is easy to crush the connector. When it is opened, the connector The male end and the female end are locked with hooks, which requires force to open. It is easy to disengage the FPC pad PIN pin welded on the product, and in severe cases, the entire connector will fall off. The result of this is The production speed is slow, the product defect rate is high, and the contact substrate is damaged quickly (the life of each connector is limited to 20-50 times when fully connected), and the manufacturing cost is high

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