Super-small-point-interval SMD (surface mounted device) composited LED lamp
A technology of LED lamps and ultra-small dots, which is applied in instruments, identification devices, etc., can solve the problems of a large number of pins and the inability to achieve a smaller dot pitch, so as to reduce the number of pins, reduce the difficulty of wiring and wiring density, and achieve high The effect of sharpness
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Embodiment 1
[0026] Specific embodiments of the present invention In order to overcome the problems in the prior art, achieve smaller dot pitches, and achieve higher definition, the existing LED module lights are improved, generally speaking, the driving part is integrated into the LED module lights Among them, a module that integrates lamps and drivers is formed, that is, the ultra-small pitch SMD composite LED lamp of the present invention.
[0027] A kind of ultra-small dot pitch SMD composite LED lamp provided by this specific embodiment is as follows: Figure 5 As shown, there are multiple groups of LED pixel lamps 2 arrayed on the upper surface of the lamp body 1 , and a plurality of pins 3 are arranged on the lower surface of the lamp body 1 . The difference from the existing LED module lamp is that the ultra-small pitch SMD composite LED lamp also includes a drive unit (not shown in the figure), the pin 3 is electrically connected to the drive unit, and the drive unit It is also e...
Embodiment 2
[0035] A kind of ultra-small dot pitch SMD composite LED lamp provided by this specific embodiment is as follows: Figure 7 As shown, it differs from Embodiment 1 in that the middle area of the lower surface of the lamp body 1 is partially recessed to form an accommodating area 5 for setting a driving chip, and the driving chip pad group 4 is arranged in the accommodating area. Placed in area 5.
[0036] The purpose of doing this is to make the ultra-small pitch SMD composite LED lamp with integrated light driver thinner and have better heat dissipation performance. In this structure, a square groove-shaped accommodation area 5 is opened in the middle of the lower surface of the lamp body 1 where the pins 3 are set, and the driver chip pad group 4 is set in the groove, and the driver chip is attached to the driver chip pad group. 4, therefore on the basis of Example 1, a thinner thickness can be achieved, and the thinner thickness itself is conducive to better heat dissipat...
Embodiment 3
[0038] A kind of ultra-small dot pitch SMD composite LED lamp provided by this specific embodiment is as follows: Figure 8 As shown, the difference between it and Embodiment 1 and Embodiment 2 is that the drive unit is a drive chip 6; the ultra-small pitch SMD composite LED lamp also includes an encapsulation layer 7; the drive chip 6 passes through the The encapsulation layer 7 is encapsulated on the lower surface of the lamp body 1 .
[0039] The aforementioned driving chip is actually the packaged driving chip 6 . Because the driver chip 6 is used in this specific embodiment, and the driver chip 6 cannot be exposed in the air, so it needs to be packaged with an encapsulation material to form the encapsulation layer 7 enclosing the driver chip 6 . The encapsulation material is preferably an encapsulation material with good heat dissipation performance, so as to facilitate heat dissipation of the driving chip 6 . This method can achieve higher integration, further reduce v...
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