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Antenna forming method and bonding head

An antenna, press-fit technology, applied in the direction of the radiating element structure, etc., can solve the problems of poor antenna efficiency and high impedance

Active Publication Date: 2015-09-30
WISTRON NEWEB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For 3D pad printing technology, it is often limited by interference and can only be applied to large arc surfaces or non-interference positions
In addition, the antenna is formed by sputtering or vapor deposition, which is easily limited by the characteristics of the manufacturing process, resulting in insufficient thickness of the metal layer and high impedance, resulting in poor antenna efficiency.

Method used

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  • Antenna forming method and bonding head
  • Antenna forming method and bonding head
  • Antenna forming method and bonding head

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Embodiment Construction

[0029] The fabrication and use of the embodiments of the present invention will be described in detail below. It should be noted, however, that the present invention provides many applicable inventive concepts, which can be embodied in various specific forms. The specific embodiments discussed herein are merely specific ways to make and use the invention, and do not limit the scope of the invention. Furthermore, repeated reference numerals or designations may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing the present invention, and do not represent any relationship between the different embodiments and / or structures discussed. Furthermore, when it is mentioned that a first material layer is located on or above a second material layer, it includes the situation that the first material layer is in direct contact with the second material layer or is separated by one or more other material layers.

[0030] Figure 1A...

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Abstract

The present invention provides a method for forming an antenna, which includes: providing a workpiece with a surface; providing a pressing head, including a main body, a soft rubber head provided on the main body, and at least one through hole, wherein the through hole Penetrating the main body and the soft rubber head; adsorbing and fixing a conductive film on the soft rubber head through the perforation; pressing the pressing head against the surface of the workpiece to press the conductive film to the surface of the workpiece on; remove the lamination head; and pattern the conductive film.

Description

technical field [0001] The present invention relates to antennas, and more particularly to methods of forming antennas and bonding heads used in the process of forming antennas. Background technique [0002] Existing metallization techniques have many limitations when applied to form antennas. Due to the difficult molding process or high impedance, the antenna design is limited and the efficiency is not good. [0003] At present, many mobile device antennas need to be designed on curved surfaces or non-coplanar planes due to space design and environmental constraints. Traditional existing technologies such as printing and hot pressing are only suitable for 2D plane design. For 3D pad printing technology, it is often limited by interference and can only be applied to large arc surfaces or non-interference positions. In addition, forming the antenna by sputtering or vapor deposition is likely to be limited by the characteristics of the manufacturing process, resulting in in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38
Inventor 麦景嘉许智清许渊钦李政翰
Owner WISTRON NEWEB