Server and cooling structure
A server and module technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of complex air duct and poor heat dissipation effect, achieve simple air duct, improve utilization rate, and enhance heat dissipation effect Effect
Active Publication Date: 2017-12-29
HUAWEI TECH CO LTD
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Problems solved by technology
[0003] The technical problem to be solved by the present invention is to solve the problem of complex air ducts and poor heat dissipation in the internal space of the server in the prior art, and improve the utilization efficiency of the fan
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Embodiment Construction
[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Arrows in the figure indicate the route of the air flow.
[0036] Such as figure 1 , figure 2 and image 3 As shown, the present invention relates to a server including a chassis 10 , a front board module 20 , a rear board module 30 , an orthogonal connector 40 and a fan 50 disposed in the chassis 10 . The front board module 20 , the rear board module 30 , the orthogonal connector 40 and the fan 50 together constitute the heat dissipation structure of the present invention, and are arranged in the chassis 10 of the server to realize the heat dissipation function. Please also see Figure 4, the front board module 20 is disposed in the front space 12 of the chassis 10 , and the rear board module 30 is disposed in the rear space 14 of the chassis 10 . The front board module 2...
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The invention discloses a server and a heat dissipation structure. The heat dissipation structure is arranged in a server case and is used for heat dissipation of the server. The heat dissipation structure includes multiple front board modules, rear board modules, multiple orthogonal connectors and fans. The plurality of front board modules are stacked in the front space of the case, the rear board modules are arranged in the rear space of the case, and the plurality of front board modules pass through the multiple An orthogonal connector is connected to the backplane module. The internal spaces of the plurality of front board modules communicate with the rear space of the chassis. The fan is arranged at the rear end of the chassis and can directly provide air volume for the plurality of front board modules. The heat dissipation structure of the present invention has a simple heat dissipation air duct, improves the utilization rate of the fan, enhances the heat dissipation capacity, and can ensure the reliability of the server.
Description
technical field [0001] The invention relates to the field of heat dissipation, in particular to a server and a heat dissipation structure. Background technique [0002] The internal structure of a server cabinet in the prior art is as follows: the front part is provided with a front board module, the rear part is provided with a rear board module orthogonal to the front board module, and the front and rear board modules There is a backplane between them, and the signal transmission is realized through the backplane, and the fan is also included in the cabinet. The front board module is placed vertically, and the rear board module is placed horizontally. Since both the fan and the rear board module need to be hot-swapped, the fans must be arranged on the upper and lower sides of the rear board module. There will be a heat dissipation problem of the front board module. Since the backplane installed between the front and rear board modules blocks the ventilation between the f...
Claims
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IPC IPC(8): G06F1/20
Inventor 彭耀锋李爽卢晓啸
Owner HUAWEI TECH CO LTD