Defect detection system and working method for particles on wafer surface
A surface particle and defect detection technology, applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as wafer damage and achieve the effect of reducing damage
Active Publication Date: 2016-08-10
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology
It is easy to cause damage to the wafer, so it is not suitable for long-term manual operation
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[0037] In the prior art wafer surface particle defect detection system, after scanning the back of the wafer, the visual inspection of the defects on the back of the wafer can only be manually operated by relevant personnel. It is easy to cause damage to the wafer, so it is not suitable for long-term manual operation.
[0038] In order to solve the above problems, the present invention provides a defect detection system for particles on the wafer surface, please refer to figure 1 Shown is a schematic structural diagram of a defect detection system for particles on the wafer surface according to an embodiment of the present invention. The detection system for particles on the wafer surface includes:
[0039] Wafer scanning device 30, used to scan the particles on the back of the wafer;
[0040] A wafer flipping device 10, configured to flip the wafer so that the back side of the wafer faces up for scanning by the wafer scanning device 30;
[0041] Optical visual inspection de...
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The invention provides a defect detection system for particles on the surface of a wafer and a working method of the defect detection system. The defect detection system comprises a wafer scanning device, a wafer overturning device, an optical visual detection device and a wafer conveying device, wherein the wafer scanning device is used for scanning the particles on the back surface of the wafer, the wafer overturning device is used for overturning the wafer to enable the back surface of the wafer to be upward so that the wafer scanning device can scan the back surface of the wafer, the optical visual detection device is used for carrying out visual detection on the particles on the back surface of the wafer, and the wafer conveying device is used for conveying the wafer among the wafer scanning device, the wafer overturning device and the optical visual detection device. The defect detection system can carry out automatic visual detection on the defects of the back surface of the wafer, enable the scanning and the visual detection on the defects of the back surface of the wafer to be more automatic and comprehensive, and reduce damage to the wafer caused by manual operation.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a defect detection system and a working method for particles on the surface of a wafer. Background technique [0002] As the size of the wafer becomes larger and the critical dimension becomes smaller, more and more attention is paid to the defects on the back of the wafer, because the defects on the back of the wafer will affect the process of the lithography machine. In the prior art wafer surface particle defect detection system, after scanning the back of the wafer, the visual inspection of the defects on the back of the wafer can only be manually operated by relevant personnel. It is easy to cause damage to the wafer, so it is not suitable for long-term manual operation. [0003] Therefore, it is necessary to transform the existing particle defect detection system on the wafer surface, so that it can have the automatic visual inspection function of the defects on the...
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IPC IPC(8): H01L21/66
CPCH01L22/12H01L22/24
Inventor 郭贤权许向辉顾珍
Owner SHANGHAI HUALI MICROELECTRONICS CORP