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A Method of Printed Circuit Board Defect Detection Based on Regularized Parameters

A printed circuit board, defect detection technology, applied in the direction of measuring devices, image data processing, instruments, etc., can solve the problems of long maintenance cycle, low detection efficiency, high price, etc., and achieve the effect of high-speed and high-reliability requirements

Active Publication Date: 2017-01-18
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the printed circuit boards produced by most enterprises in my country are still based on manual inspection or semi-automatic inspection technology, which requires a large amount of manpower and low inspection efficiency.
Although the testing equipment imported from abroad has excellent performance, it is more expensive and has a long maintenance cycle, which greatly restricts enterprises in reducing costs and improving product technology and performance.

Method used

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  • A Method of Printed Circuit Board Defect Detection Based on Regularized Parameters
  • A Method of Printed Circuit Board Defect Detection Based on Regularized Parameters
  • A Method of Printed Circuit Board Defect Detection Based on Regularized Parameters

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Experimental program
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Embodiment

[0051] Such as figure 1 As shown, the printed circuit board defect detection method based on regular words parameters in this embodiment includes the following steps:

[0052] (1) This method needs to carry out the following 2 to 6 operations on the standard printed circuit board in advance to obtain relevant standard parameters and images;

[0053] (2) converting the printed circuit board image to be tested into a binary image;

[0054] (3) The binary image of the printed circuit board is thinned by mathematical morphology technology, and the obtained image is composed of lines with a single pixel width, and the global characteristics of the original image can be preserved.

[0055] That is, after a series of structural elements with a certain shape are given, the pixels that satisfy the hit transformation are deleted sequentially and cyclically, as follows:

[0056] If T is a collection of structural elements, X is the image to be thinned, and X is defined as:

[0057] ...

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Abstract

The invention discloses a printed circuit board defect detecting method based on regularization parameters. The method includes the step 1, carrying out refining operation on binary images of a printed circuit board through a morphology technology to obtain a single-pixel and wide-line graphical representation reserving global features of original images, step 2, searching for connected domains and carrying out proper partition, grouping and shape analysis on the images, step 3, marking the original binary images by utilizing the connected domains in an iterative mode so as to obtain a group of regularization parameters relevant to the connected domains, step 4, carrying out initial matching on images to be detected and a standard image according to the regularization parameters and similarity evaluation functions, and step 5, carrying out further detection according to preset related algorithms in a program. According to the printed circuit board defect detecting method, high-speed and high-reliability demands on automatic detection of common defects like scratches, flaws, mouse bite, too-wide lines and parasitism protrusions on the printed circuit board can be met.

Description

technical field [0001] The invention relates to the technical field of defect detection, in particular to the defect detection of printed circuit boards based on regularized parameters, and is suitable for detecting scratches, cracks, mouse bites, overwide traces, parasitic protrusions and the like on printed circuit boards. Background technique [0002] Due to the printed circuit board may have poor appearance (foreign objects, air bubbles, reinforcement deviation) during processing, manufacturing and mounting; poor wiring (open circuit, short circuit, residual copper, holes, inconsistent line width, wire damage); gold surface Defects (scratches, oxidation, exposed copper) and other defects. Therefore, how to accurately detect product defects and improve production efficiency is an important link to ensure product quality. At present, the printed circuit boards produced by most enterprises in our country are still based on manual inspection or semi-automatic inspection tec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/60G06T7/00G01N21/956
Inventor 陈安王盛婷胡跃明
Owner SOUTH CHINA UNIV OF TECH
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