A system and method for detecting bubbles and crease defects in straight lines of flexible IC substrates

Abstract

The invention discloses a flexible IC base plate linear circuit bubble and folding mark defect detection system and method. The system comprises an image collection sub system, a defect detection module and a data analysis module. The method comprises the following steps that (1) the image collection sub system controls a microscope for performing positioning and photo taking on the flexible baseplate; (2) through an input image protection mechanism, the input image is a film coating flexible base plate linear circuit position; (3) a defect questionable region of the film coating flexible base plate is extracted; (4) through morphological processing, the binary image is subjected to impulse noise removal, convex interference point removal and region fine hollow filling; (5) multi-featurevalues of the flexible base plate pattern certainly having the defects are calculated; (6) the category of the defects in the flexible base plate pattern is judged; the defect region is marked in theoriginal image. The system and the method well avoid the defect wrong reporting of the flexible base plate imaging detection at different illumination intensities; higher accuracy is realized on the simultaneous detection of various defects of the film coating base plates.

Description

technical field [0001] The invention belongs to the technical field of defect detection, and relates to a system and method for detecting air bubbles and crease defects in a straight line of a flexible IC substrate. Background technique [0002] With the increase of FICS usage rate and the improvement of quality requirements, people pay more and more attention to FICS surface quality inspection. From the judgment of the existence of defects at the beginning, to the judgment of scratches and edge damage of IC wafers, to the judgment of IC pin defects and residual glue defects, to the measurement of FICS line width, line spacing and aperture size, and short circuit and open circuit judgment, you can see It is shown that the detection of FICS is from the rough judgment of the existence of defects to the judgment of specific defect categories. The quality inspection of finished film FICS products is more focused on the detection of defects such as oxidation, air bubbles, crease...

AI Technical Summary

Problems solved by technology

However, at present, there are very few detection algorithms or papers for these two types of defects in film-coated circuits, especially bubble defects often appear in the detection of glass products, pills and other fields

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