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Technology for processing film for cutting and grinding wafer

A processing technology and film cutting technology, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve problems such as wasting time, and achieve the effect of reducing the number of coating processes and high production efficiency.

Inactive Publication Date: 2014-02-05
WEISHIDA SEMICON TECH ZHANGJIAGANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, adjusting the formula requires many steps to verify, and these steps also need to go through processes such as coating and cutting, which is a waste of time

Method used

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  • Technology for processing film for cutting and grinding wafer
  • Technology for processing film for cutting and grinding wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Example 1: The above-mentioned parent roll product A is irradiated with UV while slitting, the slitting speed is 10m\min, and the irradiation amount is 50mj\cm 2 The finished product B is tested according to the national standard GB / T 2792-81, and the 180° adhesion force of product B is 4.1N\in.

Embodiment 2

[0025] Example 2: The above-mentioned parent roll product A is irradiated with UV while slitting, the slitting speed is 10m\min, and the irradiation amount is 75mj\cm 2 The finished product C is tested according to the national standard GB / T 2792-81, and the 180° adhesion force of product C is 2.2 N\in. Compared with Example 1, Example 2 increased the amount of irradiated UV, and the adhesive force of the product decreased.

Embodiment 3

[0026] Example 3: The above-mentioned parent roll product A is irradiated with UV while slitting, the slitting speed is 5m\min, and the irradiation amount is 75mj\cm 2 The finished product E is tested according to the national standard GB / T 2792-81, and the 180° adhesion force of product E is 1.3 N\in. Compared with Example 2, the slitting speed of Example 3 is reduced, and the adhesive force of the product is reduced.

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Abstract

The invention discloses a technology for processing a film for cutting and grinding a wafer. The technology comprises the following steps of 1, coating, 2, slitting and 3, detection. In the process of carrying out the step 2, UV pre-irradiation processing is carried out while the slitting is carried out, and the adhesion of the cutting film is adjusted by adjusting the amount of irradiation UV. The procedures can be reduced, especially the coating procedure, and the film product for cutting and grinding the wafer and with different adhesive forces can be produced through the one-time coating procedure.

Description

Technical field [0001] The invention relates to a semiconductor wafer processing technology, in particular to a processing technology of a film for wafer cutting and polishing. Background technique [0002] The protective film for wafer cutting and polishing, namely the film for wafer cutting and polishing, is currently mainly divided into non-UV type and UV type. The production process adopts changes in the adjustment formula, through the coating process, the cutting process, and the inspection The packaging process completes the customer’s requirements for different adhesion forces, so that each product that requires adhesion needs to go through three main processes: coating process, slitting process, and inspection packaging process. Among them, the coating process is the easiest The most time-consuming process of the problem. [0003] In addition, adjusting the formula requires many steps to verify, and these steps also need to go through processes such as coating and slitting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304
CPCH01L21/6836H01L2221/68327
Inventor 崔庆珑
Owner WEISHIDA SEMICON TECH ZHANGJIAGANG