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Display device

A technology for display devices and display panels, applied in optics, instruments, electrical components, etc., can solve problems such as poor electrical connection

Inactive Publication Date: 2014-02-12
JAPAN DISPLAY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the deflection in the center, the entire back surface is bent, and there is a concern that the bumps are deflected and the electrical connection may be poor.

Method used

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Embodiment Construction

[0050] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0051] figure 1 It is a perspective view showing an outline of a display device according to an embodiment of the present invention. The following description is an example in which the present invention is applied to a liquid crystal display device, but the present invention can also be applied to a display device other than a liquid crystal display device (for example, an EL (Electro Luminescence; electroluminescence) display device).

[0052] The liquid crystal display device includes a liquid crystal display panel 10 as an example of a display panel. The liquid crystal display panel 10 includes a first substrate 12 and a second substrate 14 overlapping with each other. The first substrate 12 and the second substrate 14 are made of a light-transmitting substrate such as glass, and a liquid crystal (not shown) is interposed therebetween. The first substrate is a co...

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Abstract

An integrated circuit chip includes first and second electrode terminals electrically connected to an internal circuit, and a dummy bump arranged between the first and second electrode terminals on a back surface thereof. A wiring pattern includes first lines electrically connected to the first electrode terminals below the back surface of the integrated circuit chip and extend in the direction toward a display region outside the integrated circuit chip, and second lines electrically connected to the second electrode terminals below the back surface of the integrated circuit chip and extend in the direction opposite to the display region outside the integrated circuit chip. The dummy bump is configured to avoid at least one of the electrical connection between the dummy bump and all of the first lines and all of the second lines and the electrical connection between the dummy bump and the internal circuit.

Description

technical field [0001] The present invention relates to display devices. Background technique [0002] A technique of mounting an integrated circuit chip incorporating a driver on a liquid crystal display panel is known (Patent Document 1). In addition, it is also known to use an anisotropic conductive film for mounting an integrated circuit chip. In the mounting process, the integrated circuit chip is heated and pressed through the anisotropic conductive film. [0003] Patent Document 1: Japanese Patent No. 3824845 [0004] On the back surface of the integrated circuit chip, electrodes are arranged on end portions along opposite sides, and bumps are provided on the electrodes. There is no bump in the center of the back. Therefore, if the integrated circuit chip is pressurized, the center will be deflected. Since the deflection occurs at the center, the entire rear surface is bent, and there is a concern that the bumps are deflected and poor electrical connection occurs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13
CPCG02F1/13454G02F1/13458H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/00H05K1/111
Inventor 阿部英明中野泰川口仁
Owner JAPAN DISPLAY INC