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Semiconductor light-emitting device and manufacturing method thereof

A manufacturing method and a technology of a light-emitting device, which are applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as poor heat dissipation effects of light-emitting devices, and achieve the effects of reducing process time and material costs

Inactive Publication Date: 2014-02-12
PHOSTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention proposes a semiconductor light emitting device and its manufacturing method to solve the defect of poor heat dissipation effect of the semiconductor light emitting device in the prior art

Method used

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  • Semiconductor light-emitting device and manufacturing method thereof
  • Semiconductor light-emitting device and manufacturing method thereof
  • Semiconductor light-emitting device and manufacturing method thereof

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Embodiment Construction

[0047] In an embodiment of this disclosure, a semiconductor light emitting device and a manufacturing method thereof are proposed. In the semiconductor light-emitting device, the paste is filled into the opening of the patterned template, and the opening is set corresponding to the light-emitting diode, so that the paste is formed into a concave substrate and then cured to form a concave substrate with heat dissipation effect, so it has The process time and material cost are reduced, so as to achieve the effect of process simplification and cost saving. However, the detailed structures and process steps proposed in the embodiments are for illustration purposes only, and are not intended to limit the protection scope of the present invention. These steps are for illustrative purposes only, and are not intended to limit the present invention. Those skilled in the art may modify or change these steps according to the needs of actual implementation.

[0048] Please refer to Fig...

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Abstract

The invention provides a semiconductor light-emitting device and a manufacturing method thereof. The manufacturing method comprises that at least one light-emitting diode is provided; a sacrificial layer is formed on the periphery of the light-emitting diode; a paste penetrates through a patterning template so that at least one concave substrate is formed, and partial surface of at least one light-emitting diode is wrapped by each concave substrate; and the concave substrate is solidified. According to the semiconductor light-emitting device, the paste penetrates through the patterning template, and the heat-radiating concave substrate is formed so that process time and material cost are reduced, and effects of simplifying process and saving cost are achieved.

Description

technical field [0001] The present invention relates to a semiconductor light-emitting device and its manufacturing method, and in particular to a semiconductor light-emitting device with a concave substrate and its manufacturing method. Background technique [0002] In recent years, light-emitting diode devices have become more and more widely used, and with the rapid development and progress of various displays, light-emitting diodes have been applied to various display technologies. In addition, light-emitting diodes can be applied to new display technologies, such as traffic signs, LCD TVs and mobile phone backlights, so related research is also flourishing. [0003] However, the heat conduction efficiency between the multi-layer structures of the light-emitting diode seriously affects its luminous efficacy and service life, which further degrades the quality of the display. Therefore, the structure and process of improving and improving the heat dissipation effect of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/64H01L33/00
CPCH01L33/005H01L33/483H01L33/642
Inventor 邵世丰
Owner PHOSTEK INC