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Multilayer circuit board and method of making the same

A manufacturing method and circuit board technology, which are applied in the direction of multi-layer circuit manufacturing, printed circuit components, etc., can solve the problems of many pressing times, high manufacturing cost and low manufacturing efficiency.

Active Publication Date: 2016-08-24
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the manufacturing process of the above-mentioned multi-layer circuit board, every time a layer is added, a pressing process is required. When making a circuit board with more layers, the number of times of pressing is correspondingly more, which is not conducive to the process. simplification, the production cost is relatively high, and the production efficiency is relatively low

Method used

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  • Multilayer circuit board and method of making the same
  • Multilayer circuit board and method of making the same
  • Multilayer circuit board and method of making the same

Examples

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no. 2 example

[0063] The second embodiment: in this embodiment, M is a natural number greater than or equal to 2, and N is greater than 2M-1) The laminated substrate can be formed by the following method: first, one of the M first circuit substrates 110 The first circuit substrate 110 is used as the outermost circuit substrate; secondly, in the remaining M-1 first circuit substrates 110 and M-1 third circuit substrates 130, a third circuit substrate 130 and a first circuit substrate The substrates 110 are stacked to form a first stacking unit with only two circuit substrates, thereby obtaining M-1 first stacking units; then, N-2M+1 second circuit substrates 120 are stacked to form a second circuit substrate only The second stacking unit of the substrate 120, the second stacking unit may include one or more second circuit substrates 120; finally, M-1 stacking units of the first stacking unit and the second stacking unit are stacked as the final on the first circuit substrate 110 of the outer...

no. 3 example

[0068] The third embodiment: in this embodiment, M is a natural number greater than or equal to 2, and N=3M-2) The laminated substrate can be formed by the following method: first, one of the M first circuit substrates 110 The first circuit substrate 110 is used as the outermost circuit substrate; secondly, in the remaining M-1 first circuit substrates 110, M-1 second circuit substrates 120 and M-1 third circuit substrates 130, one The first circuit substrate 110, one second circuit substrate 120 and one third circuit substrate 130 are stacked to form a third stacked unit with only three circuit substrates, thereby obtaining (M-1) third stacked units; finally, the M - 1 third stacking unit is stacked on the first circuit substrate 110 as the outermost circuit substrate, and the third circuit substrate 130 in each third stacking unit is larger than that in the corresponding third stacking unit The first circuit substrate 110 is close to the first circuit substrate 110 as the ou...

no. 4 example

[0075] Fourth Embodiment: In this embodiment, M is a natural number greater than or equal to 1, and N is greater than 2M. The laminated substrate can be formed by the following method: first, a third circuit substrate 130 and a first circuit substrate 110 to form a first stacking unit with only two circuit substrates, thereby obtaining M first stacking units; secondly, stacking N-2M second circuit substrates 120 to form a second stacking unit; finally, The M first stacking units and the second stacking units are stacked on the first copper foil sheet 28, and the third circuit substrate 130 in each first stacking unit is compared with the corresponding first stacking unit. The first circuit substrate 110 in the stack is close to the first copper foil sheet 28, and the first film 17 of each second circuit substrate 120 in the second stacking unit is smaller than the second film 17 of the corresponding second circuit substrate 120. The conductive circuit patterns 16 are all close...

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Abstract

A method for manufacturing a multilayer circuit board, comprising: providing a plurality of copper foil substrates; making the copper foil layer of each copper foil substrate to form a conductive circuit layer to obtain a plurality of first circuit substrates; A film is attached to one surface of the film, a through hole is formed in the film, and a conductive material is formed in the through hole, and the conductive material and the conductive circuit layer are electrically connected to each other to obtain a second circuit substrate; part of the two first circuit substrates Laying a film on the surface, forming a through hole in the film, forming a conductive material in the through hole, and electrically conducting the conductive material and the conductive circuit layer to obtain a third circuit substrate; laminating the third circuit substrate, the second circuit substrate and One, two or three of the first circuit substrates or laminated copper foils at the same time to form a laminated substrate, and press the laminated substrate or make the copper foil into a conductive circuit pattern, so as to obtain multiple layer circuit board. The invention also provides a multilayer circuit board prepared by the method.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a multilayer circuit board and a manufacturing method thereof. Background technique [0002] With the development of electronic products in the direction of miniaturization and high speed, circuit boards are also developing from single-sided circuit boards, double-sided circuit boards to multi-layer circuit boards. Multilayer circuit board refers to a circuit board with multiple layers of conductive lines, which has more wiring area and higher interconnection density, so it is widely used, see Takahashi, A. Ooki, N. Nagai, A. Akahoshi , H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425 . [0003] At present, multilayer circuit boards are usually produced by a build-up method, that is, they are produced in a manner of stacking layers. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/02
Inventor 郑兆孟覃海波
Owner AVARY HLDG (SHENZHEN) CO LTD