A communication single board and communication equipment
A technology of communication equipment and a single board, which is applied in the field of communication, can solve problems affecting system integration, occupying additional chassis height, affecting connector reliability, etc., and achieve the effect of avoiding system heat dissipation failure
Active Publication Date: 2016-03-30
XFUSION DIGITAL TECH CO LTD
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- Abstract
- Description
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- Application Information
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Problems solved by technology
However, in the above-mentioned anti-backflow structure, the anti-backflow sheet is integrated in the machine frame, which occupies an additional height of the machine frame and affects the system integration; in addition, the anti-backflow sheet is flush with the panel, and the slideway cannot be seen
As a result, the connector of the communication single board inevitably collides with the anti-backflow sheet, which affects the reliability of the connector
Method used
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[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0028] See Figure 3 to Figure 5 , the communication device according to the embodiment of the present invention includes a plurality of communication single boards 10 , a heat dissipation device 20 , and a chassis 30 . The communication board 10 is provided with electronic components for completing communication functions. The chassis 30 includes a chassis frame (not shown in the figure), and the chassis frame is provided with a plurality of installation slots 31...
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The invention provides a communication board. The communication board comprises a circuit board, a board handle strip, a backflow-preventing board, a supporting board and a locking structure, wherein the backflow-preventing board and the supporting board are connected with the board handle strip in a rotary mode, one end of the backflow-preventing board is connected with the board handle strip in a rotary mode, the other end of the backflow-preventing board is a free end, the locking structure comprises a first rotary portion, a second rotary portion and a rotary shaft, the rotary shaft is connected with the supporting board in a rotary mode, the first rotary portion is arranged on one side of the board handle strip, and is used for limiting movement of the free end of the backflow-preventing board, and the second rotary portion is arranged on the other side of the board handle strip, and is used for having control over rotation of the first rotary portion. According to the communication board, the height of a machine case frame cannot be additionally occupied by the backflow-preventing structure of the communication board, and the communication board can be protected. The invention further provides a communication device with the communication board.
Description
technical field [0001] The invention relates to the technical field of communication, in particular to a communication single board and communication equipment. Background technique [0002] A communication device generally includes a chassis, and a plurality of communication single boards are arranged in the chassis to realize a communication function. These communication single boards are sequentially inserted in parallel in the installation slots of the chassis. The communication components of the communication board will generate heat during operation. In order to ensure the normal operation of the above components, it is necessary to dissipate heat for these communication components in time. Communication equipment is usually equipped with fans or air conditioners for heat dissipation. Air ducts are formed between communication boards, between communication boards and chassis frames, or in installation slots where communication boards are not installed, and air flows t...
Claims
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IPC IPC(8): H05K7/20
Inventor 聂飞钟杨帆田伟强
Owner XFUSION DIGITAL TECH CO LTD