Unlock instant, AI-driven research and patent intelligence for your innovation.

Novel welding arm driving device of die bonder

A technology of driving device and die bonding machine, which is applied in the directions of manipulators, program-controlled manipulators, manufacturing tools, etc., which can solve the problems of inability to move vertically, the time of moving becomes longer, and the welding efficiency is affected.

Inactive Publication Date: 2014-02-26
THE CATHAY ROBOTICS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing semiconductor die-bonding device, the welding arm is moved. Since the trajectory of the welding arm can only be moved in a straight line in the two-dimensional X-Y coordinate system, the parallel moving motor and the vertical moving motor are integrated. The process of translation Vertical movement cannot be performed, and vertical movement can only be performed after the translation is completed, which makes the moving time longer, thus affecting welding efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel welding arm driving device of die bonder
  • Novel welding arm driving device of die bonder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] In order to make the purpose, technical solutions and advantages of the invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the invention Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] Such as figure 1 and figure 2 As shown, the present invention provides a new embodiment of a driving device for a welding arm of a die bonder.

[0017] The drive device for the welding arm of the new crystal bonding machine includes: a motor base 1 provided with a parallel movement motor 3, a vertical movement motor 2 is provided at the end of the motor base 1, and a wel...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a novel welding arm driving device of a die bonder. The novel welding arm driving device comprises a motor base. The motor base is provided with a parallel translation motor, vertical movement motors are arranged at an end of the motor base, a rotary shaft of the parallel translation motor is provided with a welding arm connecting seat, a plurality of welding arms are uniformly distributed on the periphery of the outer side of the welding arm connecting seat, each welding arm comprises a welding arm body, each welding arm body is provided with a wafer suction nozzle, and the parallel translation motor and the vertical movement motors are respectively connected with a control module. The novel welding arm driving device has the advantages that after the welding arms are shifted to required positions by the parallel translation motor, the welding arm connecting seat is downwardly shifted by the vertical movement motors, and the wafer suction nozzles are precisely repositioned by sliding cylinders arranged among the welding arm bodies and suction nozzle supports, so that wafers can be picked up, and follow-up bonding operation can be carried out; the welding arms can be downwardly shifted to the proper positions by the vertical movement motors via proper adjustment and control when the parallel translation motor parallelly translates, so that the vertical movement motors can be prevented from being in complete idle states when the parallel translation motor parallelly translates, the shifting time can be shortened, and the welding efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor crystal bonding, in particular to a novel crystal bonding machine welding arm drive device in which a translational motor and a vertical motor for the crystal bonding machine are separated. Background technique [0002] When the semiconductor crystal bonding device is in operation, it is necessary to transport the materials for the crystal bonding to the corresponding position through the feeding device, and then the crystal, such as the LED wafer, is moved to the corresponding position of the substrate by the robot for welding. [0003] In the existing semiconductor die-bonding device, the welding arm is moved. Since the trajectory of the welding arm can only be moved in a straight line in the two-dimensional X-Y coordinate system, the motor for parallel movement and the motor for vertical movement are integrated. The process of translation The vertical movement cannot be performed, and the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B25J9/12B25J9/02
Inventor 区大公
Owner THE CATHAY ROBOTICS