A Reliability Design Method for Total Dose Irradiation Test Board of Aerospace Devices

A technology of total dose irradiation and test board, applied in the direction of instrument, calculation, special data processing application, etc., can solve the problem of easy error of the same signal port, improve design efficiency, reduce virtual connection and short connection, and reduce connection errors Effect

Active Publication Date: 2016-07-06
BEIJING MXTRONICS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At present, most of the methods used are to directly connect the port signals in the AltiumDesignerSummer08 schematic diagram, but due to the sharp increase of the same signal ports (ports connected to the same signal), it is easy to make mistakes in the design

Method used

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  • A Reliability Design Method for Total Dose Irradiation Test Board of Aerospace Devices
  • A Reliability Design Method for Total Dose Irradiation Test Board of Aerospace Devices

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Embodiment Construction

[0024] Taking the chip packaged in PGA391 as an example, the reliability design method of the present invention is introduced based on the AltiumDesignerSummer08 design tool, which specifically includes the following steps:

[0025] The first step is to add leads of the same length to each pin of the chip;

[0026] Use the method of cluster replication, that is, firstly arrange the leads of the same length vertically at equal intervals according to the requirements of the pins, and then when a certain number is reached (it is best to add all the leads on the same side at one time), add them as a whole to individual pins on the same side.

[0027] In the second step, the network identification of each pin of the chip is defined according to the format of pin number_signal name, and added to the lead of the corresponding pin; the signal name includes IN for indicating input, which is used to indicate VDD(3.3) of 3.3V power supply, GND(3.3) used to represent the ground terminal ...

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Abstract

The invention discloses a method for reliability design of a total dose irradiation test board for aerospace devices. The network identification of each pin of the chip is defined according to the format of pin number_signal name; and a rectangle corresponding to the input signal IN is formed respectively. frame, the rectangular frame corresponding to the 3.3V power supply, the rectangular frame corresponding to the ground terminal of the 3.3V power supply, the rectangular frame corresponding to the 1.8V power supply, the rectangular frame corresponding to the ground terminal of the 1.8V power supply; the rectangular frame corresponding to the 3.3V power supply and the 3.3V power supply Connect the rectangular frame corresponding to the ground terminal through the 3.3V power supply terminal; connect the rectangular frame corresponding to the 1.8V power supply and the rectangular frame corresponding to the 1.8V power supply ground terminal through the 1.8V power supply terminal; connect the rectangular frame corresponding to the input signal IN to the 3.3V power supply The corresponding rectangular frames are connected by electric wires; finally, the total dose radiation test board for the aerospace device is formed. The reliability design method of the present invention greatly reduces virtual connections and short connections that occur in the development process of the total dose irradiation test board for aerospace devices, and avoids missing connections and connection errors.

Description

technical field [0001] The invention relates to the technical field of test and verification of anti-total dose capability of aerospace devices. technical background [0002] The rapid development of integrated circuit design technology and semiconductor processing technology has made the integration of aerospace microelectronic devices higher and higher, and the single chip has more and more functions, followed by a large increase in chip pins. Increase, even up to thousands of pins, for users to use different internal functional modules. On the other hand, the modular design and the limitation of the internal power consumption of the module also lead to a large increase in the external power supply ports of the integrated circuit. These two phenomena become more and more prominent as the integration of aerospace devices increases. [0003] Aerospace devices are characterized by their radiation resistance. Due to the existence of a large number of space particles (charge...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 杜守刚范隆岳素格
Owner BEIJING MXTRONICS CORP
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