The invention discloses a high-thermal-
conductivity ceramic substrate containing filling
copper columns and a manufacturing process of the high-thermal-
conductivity ceramic substrate. According to the high-thermal-
conductivity ceramic substrate containing the filling
copper columns, a plurality of through holes are formed in the
ceramic substrate, the through holes are formed by performing penetrating and
punching in the thickness direction of the
ceramic substrate through ceramic wafers, the areas of upper hole openings and lower hole openings of the through holes are unequal, and the filling
copper columns are arranged in the through holes. The manufacturing process of the high-thermal-conductivity
ceramic substrate comprises the steps of (1) performing penetrating and
punching in the thickness direction of the ceramic wafers, (2) sequentially
sputtering buffer
layers and conductive
layers on the punched ceramic wafers, (3) performing electrocoppering, enabling the lower openings of the holes to be closed, obtaining blind holes, and (4) continuing to carry out
electroplating, and enabling the blind holes to be filled. The areas of the upper hole openings and the lower hole openings of the through holes of the substrate are unequal, through holes are filled, the problem of filling of cylindrical holes can be solved, when the substrate is used for
interconnection of a plurality of ceramic circuit boards, positioning and connection between the ceramic circuit boards are facilitated, and conduction of circuits on the upper side and the lower side is achieved.