Mold modification mechanism for modifying bending deformation of punch products

Abstract

The invention discloses a mold modification mechanism for modifying bending deformation of punch products. The mold modification mechanism comprises a stripper modification insert arranged on a stripper backboard and a lower mold modification insert arranged on a lower mold backboard and is located under the stripper modification insert, multiple indents and modification tooth grooves distributedalong the longitudinal direction at intervals are arranged in the lower side of the stripper modification insert, and modification convex teeth matched with the modification tooth grooves to modify vertical bending deformation of product material straps. Through vertical matching of the modification tooth grooves and the modification convex teeth, multiple modification positions are formed along the longitudinal direction of the product material straps, an IC (integrated circuit) chip metal lead frame with vertical downward curved bending deformation can be modified, quality requirements can be greatly improved, quality requirements of the whole production process of an IC chip are favorably stabilized, production qualified rate can be greatly increased, increasing tense requirements are met, and further development of information technology is favorably promoted.

Description

【Technical Field】 [0001] The application relates to the technical field of mold structures, and specifically to a mold correction mechanism for correcting bending deformation of stamping products. 【Background technique】 [0002] With the development of information technology, there is an increasing demand for metal lead frames in integrated circuit (IC) chips, and their shapes are becoming more minute and precise. There are two production methods for IC chip lead frames: corrosion processing and stamping processing. Although corrosion processing can achieve very fine precision, it cannot achieve higher production efficiency and lower production costs. With the rapid decline in the price of IC chips represented by computer memory and CPU, stamping and forming IC chip metal lead frames are used It is an important way to reduce IC chip prices and improve production efficiency. [0003] However, after the stamping and production of the IC chip metal lead frame is completed, the metal...

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Problems solved by technology

Although corrosion processing can achieve very fine precision, it cannot achieve high production efficiency and low production cost. With the rapid decline in the price of IC chips represented by computer memory sticks and CPUs, stamping and forming IC chip metal lead frames are used. It is an important way to reduce the price of IC chips and improve production efficiency

[0003] However, after the metal lead frame of the IC chip is stamped and produced, it is easy to cause bending deformation of the metal lead frame due to the existence of internal stress. For example, the arc bending deformation along the vertical downward direction of the IC chip metal lead frame will seriously affect the IC chip. The subsequent manufacturing process of the chip is carried out smoothly, so the problem of bending and deformation of the metal lead frame of the IC chip is a technical problem that plagues stamping and forming, which cannot meet the increasingly tense demand, and also restricts the further development of information technology.

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