High-thermal-conductivity ceramic substrate containing filling copper columns and manufacturing process thereof

A technology of high thermal conductivity ceramics and ceramic substrates, applied in the direction of multilayer circuit manufacturing, electrical connection formation of printed components, electrical connection of printed components, etc., can solve problems such as poor thermal conductivity, achieve the effect of improving controllability and simplifying the process

Inactive Publication Date: 2014-07-30
HUIZHOU LEADAO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sintered silver paste is a mixture with poor thermal conductivity, not as high as copper

Method used

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  • High-thermal-conductivity ceramic substrate containing filling copper columns and manufacturing process thereof
  • High-thermal-conductivity ceramic substrate containing filling copper columns and manufacturing process thereof
  • High-thermal-conductivity ceramic substrate containing filling copper columns and manufacturing process thereof

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preparation example Construction

[0045] A preparation process for a high thermal conductivity ceramic substrate containing filled copper pillars, comprising the following steps:

[0046] 1) By adjusting the diameter and energy of the laser spot, drill holes along the thickness direction of the ceramic sheet. The diameter of the upper opening of the hole is 100-200 μm, and the diameter of the lower opening is 30-80 μm;

[0047] After this step processing, it is formed as figure 1 In the shown structure, a hole 11 is formed on the ceramic sheet 1, the hole is a tapered hole, the diameter of the upper opening is 100-200 μm, and the diameter of the lower opening is 30-80 μm;

[0048] 2) Sputter the buffer layer and the conductive layer sequentially on the perforated ceramic sheet;

[0049] After this step processing, it is formed as figure 2 In the shown structure, after the ceramic sheet 1 containing the hole 11 is sputtered, a structure comprising a buffer layer 2 and a conductive layer 3 is formed, the cond...

Embodiment 1

[0063] A preparation process for a high thermal conductivity ceramic substrate containing filled copper pillars, comprising the following steps:

[0064] 1) By adjusting the laser spot diameter and energy, drill 12 holes along the thickness direction of the 0.1mm thick aluminum nitride ceramic sheet (the surface size of the ceramic sheet is 7mm×7mm), and the 12 holes are evenly distributed in a matrix of 3×4 On the ceramic sheet, the diameter of the upper opening of a single hole is 180 μm, and the diameter of the lower opening is 80 μm;

[0065] 2) Sputter the Ti / W buffer layer (the thickness of the buffer layer: 400 ?, the mass ratio of Ti and W is 1:1) and the conductive layer Cu of 450 ? sequentially on the perforated ceramic plate;

[0066] 3) DC electroplating copper for 0.5h, so that the lower opening of the hole is closed, and a blind hole is obtained;

[0067] 4) Continue DC electroplating of Cu3h, and the electroplating is single-sided electroplating, so that the bl...

Embodiment 2

[0069] A preparation process for a high thermal conductivity ceramic substrate containing filled copper pillars, comprising the following steps:

[0070] 1) By adjusting the laser spot diameter and energy, drill 12 holes along the thickness direction of the 0.38mm thick aluminum nitride ceramic sheet (the surface size of the ceramic sheet is 7mm×7mm), and the 12 holes are evenly distributed in a matrix of 3×4 On the ceramic sheet, the diameter of the upper opening of the hole is 120 μm, and the diameter of the lower opening is 40 μm;

[0071] 2) Sputter the W / Mo buffer layer (the thickness of the buffer layer: 300 ?, the mass ratio of W and Mo is 1:1) and the conductive layer Cu of 300 ? sequentially on the perforated ceramic plate;

[0072] 3) DC electroplating copper for 0.5h, so that the lower opening of the hole is closed, and a blind hole is obtained;

[0073] 4) Continue DC electroplating for Cu2.5h, and the electroplating is single-sided electroplating, so that the bli...

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Abstract

The invention discloses a high-thermal-conductivity ceramic substrate containing filling copper columns and a manufacturing process of the high-thermal-conductivity ceramic substrate. According to the high-thermal-conductivity ceramic substrate containing the filling copper columns, a plurality of through holes are formed in the ceramic substrate, the through holes are formed by performing penetrating and punching in the thickness direction of the ceramic substrate through ceramic wafers, the areas of upper hole openings and lower hole openings of the through holes are unequal, and the filling copper columns are arranged in the through holes. The manufacturing process of the high-thermal-conductivity ceramic substrate comprises the steps of (1) performing penetrating and punching in the thickness direction of the ceramic wafers, (2) sequentially sputtering buffer layers and conductive layers on the punched ceramic wafers, (3) performing electrocoppering, enabling the lower openings of the holes to be closed, obtaining blind holes, and (4) continuing to carry out electroplating, and enabling the blind holes to be filled. The areas of the upper hole openings and the lower hole openings of the through holes of the substrate are unequal, through holes are filled, the problem of filling of cylindrical holes can be solved, when the substrate is used for interconnection of a plurality of ceramic circuit boards, positioning and connection between the ceramic circuit boards are facilitated, and conduction of circuits on the upper side and the lower side is achieved.

Description

technical field [0001] The invention relates to a high thermal conductivity ceramic substrate containing filled copper pillars and a preparation process thereof. Background technique [0002] Due to the demand for high power and high thermal conductivity, alumina ceramic sheets or aluminum nitride ceramic sheets are widely used as circuit insulation substrates. However, the thermal conductivity of alumina ceramics is 20W / mK, and the thermal conductivity of aluminum nitride ceramics is 160W / mK, which still cannot meet the requirements. Copper pillars are needed to conduct the current and heat of the substrate from the front to the back, and the thermal conductivity of copper is 380W / mK. [0003] Sometimes ceramic circuit boards need to be connected with multiple layers to form a multi-layer circuit board. This design can also be realized by using copper pillars to form a multi-layer 3D interconnected ceramic circuit board. This heat conduction method can effectively conduct...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11H05K3/40H05K3/46
Inventor 崔国峰赵杰
Owner HUIZHOU LEADAO ELECTRONICS MATERIAL
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