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Lamination method and lamination system

A technology of stacking body and stacking device, applied in chemical instruments and methods, lamination, layered products, etc., can solve the problems of undisclosed semiconductor in/out, etc., and achieve the effect of improving the yield

Active Publication Date: 2016-08-24
THE JAPAN STEEL WORKS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, in Patent Document 3, it is not disclosed how semiconductors are carried in / out to a lamination device equipped with a pressurized film.

Method used

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  • Lamination method and lamination system
  • Lamination method and lamination system

Examples

Experimental program
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Embodiment Construction

[0045] For the lamination system 11 of this embodiment, refer to Figure 1 to Figure 3 Be explained. The lamination system 11 of this embodiment laminates the film-like laminate F on the semiconductor wafer W by superimposing the semiconductor wafer W which is a brittle laminated body and the film-like laminate F, and heating and pressurizing. The stacking system 11 is composed of a stacking device 12 for stacking the semiconductor wafer W and the film-like laminate F, a transport mechanism 13 for the semiconductor wafer W and the film-like laminate F, and the like.

[0046] Such as figure 1As shown, in the stacking device 12, the lower plate 15 and the upper plate 14 are arranged opposite to each other. The lower wall 15 can rise and fall relative to the upper wall 14 , and when the upper wall 14 and the lower wall 15 are closed, a vacuum chamber C is formed between the upper wall 14 and the lower wall 15 . The vacuum chamber C can be evacuated by an unillustrated vacuum p...

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Abstract

The present invention provides a lamination method and a lamination system capable of performing good lamination of film-like laminates without damage even in the case of brittle laminates such as thinned semiconductors and semiconductors made of highly brittle materials. In the lamination method of laminating the film-like laminate (F) on the brittle laminate (W) by overlapping the brittle laminate (W) and the film-like laminate (F) and heating and pressurizing, The brittle laminated body (W) transported into the lamination device (12) on the loading member (36) bulges the elastic film body (16) from above in the vacuum chamber (C) of the lamination device (12), The brittle laminated body (W) and the film-like laminated body (F) are laminated under pressure.

Description

technical field [0001] The present invention relates to a lamination method and a lamination system, and particularly to a lamination method and a lamination system in which a film-like laminate is laminated on a brittle to-be-laminated body placed on a mounting member and conveyed. Background technique [0002] When laminating a film such as an NCF film on a laminated body such as a semiconductor wafer, a lamination apparatus using a roll as disclosed in Patent Document 1 has conventionally been used. When the thickness of the laminated body to be stacked is thin but flexible, the continuous stacked body is transported for lamination molding, but generally the stacked body and the film are placed on the conveying film and transported to the stacking device. Into the cascading way. In this method, when a laminated body such as a semiconductor wafer is placed on or transported from the transport film, it is necessary to use human hands and / or robots (robots) for transporting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677
CPCB32B37/0046B32B37/1027H01L21/67092B32B37/1009B32B2309/105B32B2457/14H01L21/67132Y10T156/17H01L23/12H01L21/02104
Inventor 广濑智章冈野敦田岛久良山本隆幸
Owner THE JAPAN STEEL WORKS LTD
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