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Solder wire structure preventing splashing

A technology of solder wire and flux, applied in welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of spatter, single pressure release direction, pressure release, etc.

Inactive Publication Date: 2014-03-26
KUNSHAN HONGJIA SOLDER MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Therefore, the object of the present invention is to provide a solder wire structure that prevents splashing, which can not only solve the problem of pressure release during welding, but also solve the phenomenon of spatter caused by a single direction of pressure release.

Method used

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  • Solder wire structure preventing splashing
  • Solder wire structure preventing splashing
  • Solder wire structure preventing splashing

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Embodiment Construction

[0024] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0025] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways than those described here, so the present invention is not limited by the specific embodiments disclosed below.

[0026] As mentioned in the background art, since not only the problem of pressure release during the soldering process needs to be solved, but also the phenomenon of spatter caused by a single direction of pressure release needs to be solved, so it is necessary to provide a solder wire structure that prevents spatter.

[0027] see Figure 4 , Figure 4 It is a schematic diagram of a preferred embodiment of the anti-spatter solder wire st...

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PUM

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Abstract

The invention provides a solder wire structure preventing splashing. The solder wire structure comprises flux and solder alloy, wherein the solder alloy is spirally wound on the surface of the flux, and gaps exist between winding portions each turn of the solder alloy. By means of the solder wire structure preventing splashing, due to the fact that the solder alloy is spirally wound on the surface of the flux, an included angle is formed between each gap and the flux in the axial direction, and the gaps are not parallel with the flux. Accordingly, the flux has weight both in the axial direction and the radial direction in the soldering process so as to completely release pressure instead of releasing the pressure in the axial direction of the flux, and accordingly splashing is not caused.

Description

【Technical field】 [0001] The invention relates to a solder wire structure, in particular to a solder wire structure for preventing spatter. 【Background technique】 [0002] Solder wire is often used in various electronic products such as computer motherboards, computer peripheral products, household appliances, power boards, UPS power supplies, and medical equipment. Solder wire is suitable for high-end electronic products or high-demand electronic and electrical industries due to its low melting point, high tensile strength and shear strength, and good wettability. [0003] see figure 1 , figure 1 It is a schematic diagram of the solder wire structure in the prior art. The solder wire structure in the prior art generally includes: a flux 1 ; and a solder alloy 2 wrapped outside the flux 1 . [0004] However, with the solder wire structure of the prior art, since the solder alloy 2 fully wraps the flux 1, it is easy to cause tin frying during soldering, resulting in splas...

Claims

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Application Information

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IPC IPC(8): B23K35/14B23K35/16B23K35/363
CPCB23K35/0261B23K35/3613
Inventor 易升明
Owner KUNSHAN HONGJIA SOLDER MFG
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