Solder wire structure preventing splashing

A technology of solder wire and flux, applied in welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of spatter, single pressure release direction, pressure release, etc.

Inactive Publication Date: 2014-03-26
KUNSHAN HONGJIA SOLDER MFG
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AI-Extracted Technical Summary

Problems solved by technology

[0009] Therefore, the object of the present invention is to provide a solder wire structure that prevents splashing, which can not only solv...
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Method used

Compared with prior art, utilize the solder wire structure of preventing spatter of the present invention, because described solder alloy 2000 adopts helical winding on the surface of described flux 1000, so described gap and described flux 1000 The axial direction is at a certain angle, not parallel to it. Therefore, during the soldering process, there are components in the axial and radial directions of the flux 1000, which can achieve comprehensive pressure release, not just in the axial direction of the flux 1000. The pressure can be released so that there is no splashing.
Please refer to Fig. 1 and Fig. 4 in conjunction with Fig. 1, compared with the structure in Fig. 1, the solder wire structure preventing spatter of the present invention, because its solder alloy 2000 is by the mode of helical winding, and between every circle winding There is a gap, so it can achieve the effect of preventing tin from frying.
Please refer to Fig. 1 and Fig. 4 in conjunction with the structure in Fig. 1, compared with the structure in Fig. 1, the solder wire structure preventing spatter of the present invention, because its solder alloy 2000 is by the mode of spiral winding, and between every circle winding There is a gap, so t...
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Abstract

The invention provides a solder wire structure preventing splashing. The solder wire structure comprises flux and solder alloy, wherein the solder alloy is spirally wound on the surface of the flux, and gaps exist between winding portions each turn of the solder alloy. By means of the solder wire structure preventing splashing, due to the fact that the solder alloy is spirally wound on the surface of the flux, an included angle is formed between each gap and the flux in the axial direction, and the gaps are not parallel with the flux. Accordingly, the flux has weight both in the axial direction and the radial direction in the soldering process so as to completely release pressure instead of releasing the pressure in the axial direction of the flux, and accordingly splashing is not caused.

Application Domain

Welding/cutting media/materialsSoldering media

Technology Topic

Solder ballSoldering process +1

Image

  • Solder wire structure preventing splashing
  • Solder wire structure preventing splashing
  • Solder wire structure preventing splashing

Examples

  • Experimental program(1)

Example Embodiment

[0024] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0025] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described herein, so the present invention is not limited by the specific embodiments disclosed below.
[0026] As described in the background art, since it is not only necessary to solve the problem of pressure release during welding, but also to solve the phenomenon of spatter caused by the single direction of pressure release, so it is necessary to provide a structure of solder wire that prevents spatter.
[0027] See Figure 4 , Figure 4 Shown is a schematic diagram of a preferred embodiment of the spatter-preventing solder wire structure of the present invention.
[0028] To achieve the above objective, the present invention provides a spatter-resistant solder wire structure, the solder wire structure includes:
[0029] Flux 1000;
[0030] The solder alloy 2000 is spirally wound on the surface of the flux 1000, and there is a gap between each winding part of the solder alloy 2000.
[0031] Please refer to figure 1 , Figure 4 ,versus figure 1 Compared with the structure in the present invention, the spatter-preventing solder wire structure of the present invention, because the solder alloy 2000 is spirally wound, and there is a gap between each winding, so it can prevent tin explosion during the welding process .
[0032] Please refer to figure 2 , Figure 4 ,versus figure 2 Compared with the structure in the present invention, the spatter-preventing solder wire structure of the present invention, because the solder alloy 2000 is spirally wound, and there is a gap between each winding, so it can achieve a uniform pressure release during the welding process .
[0033] Please refer to image 3 , Figure 4 ,versus image 3 Compared with the structure in the present invention, the spatter-preventing solder wire structure of the present invention, because the solder alloy 2000 is spirally wound, and there is a gap between each winding, so it can not only reach the The function of the flux 1000 to uniformly release the pressure can also achieve the release pressure component in the radial direction of the flux 1000, so as to achieve the full release pressure of the flux 1000.
[0034] Please refer to figure 1 , Figure 4 ,versus figure 1 Compared with the structure in the present invention, the spatter-preventing solder wire structure of the present invention, because the solder alloy 2000 is spirally wound, and there is a gap between each winding, it can achieve the effect of preventing tin explosion.
[0035] It should be noted that the solder alloy 2000 may be a tin-silver-copper series alloy, of course, it may also be made of other materials.
[0036] It should be noted that the solder alloy 2000 may be a tin-lead series alloy, of course, it may also be made of other materials.
[0037] It should be noted that the flux 1000 has a cylindrical structure, so that the solder alloy 2000 can be wound on it conveniently. Of course, the flux 1000 can also have other shapes.
[0038] It should be noted that the angle between the plane of the winding part of each winding and the radial plane of the flux 1000 may be 15 degrees, so that the gap is at a certain angle to the axial direction of the flux 1000 instead of Parallel, so that there is a component in the axial and radial directions of the flux 1000 during the welding process, which can achieve full pressure release, so as not to cause splashing. The above angle is only 15 degrees as an example, and it is not limited to changing the angle. Of course, other angles such as 30 degrees, 45 degrees, and 60 degrees can also be used.
[0039] It should be noted that the width of each winding part of the solder alloy 2000 and the size of the gap can be the same, which can facilitate manufacturing.
[0040] It should be noted that the spirally wound solder alloy 2000 may be in a strip shape.
[0041] It should be noted that the soldering flux 1000 is rosin, and the rosin may be single-core or three-core. The rosin may include premium rosin and modified rosin.
[0042] Compared with the prior art, using the spatter-preventing solder wire structure of the present invention, since the solder alloy 2000 is spirally wound on the surface of the flux 1000, the gap and the axial direction of the flux 1000 are A certain angle, not parallel to it, so there is a component in the axial and radial directions of the flux 1000 during the welding process, which can achieve full pressure release, not just in the axial direction of the flux 1000. , So as not to cause splashing.
[0043] Although the present invention has been disclosed as above in preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can use the methods and technical content disclosed above to improve the present invention without departing from the spirit and scope of the present invention. The technical solution makes possible changes and modifications. Therefore, all simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention belong to the technical solution of the present invention. protected range.

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