Forming method for milling shapes of packaging substrates, plate loading and unloading device and cushion block jig

Abstract

The invention discloses a forming method for milling the shapes of packaging substrates, a plate loading and unloading device and a cushion block jig. The forming method comprises the following steps of providing a bakelite plate with drilled positioning holes, installing jacking jigs on the Bakelite plate, and installing the bakelite plate on a milling machine platform; installing first pins in the positioning holes of the bakelite plate, and enabling the first pins to be vertical to the plane of the bakelite plate; stacking a cover plate, a product plate and a cushion plate into stacked plates from top to bottom, putting the stacked plates on the bakelite plate and sheathing the positioning through holes of the stacked plates into the first pins; processing the shape of a product plate by using a milling machine to form the plurality of packaging substrates corresponding to the hollow areas of the cushion plate; and after jacking up the whole stacked plates using the jacking jigs, transferring the stacked plates, putting the stacked plates on the cushion block jig, and enabling convex blocks of the cushion block jig to penetrate through the hollow areas of the cushion plate so as to jack up the packaging substrates. The forming method is beneficial to improving the plate loading and unloading efficiency, and is also beneficial to preventing the packaging substrates from being damaged.

Description

technical field [0001] The invention relates to the field of milling contours of packaging substrates, in particular to a method for forming the contours of packaging substrates by milling, a device for upper and lower plates when milling the contours of the packaging substrates, and a spacer jig. Background technique [0002] Compared with PCB, PKG products are thinner and smaller in size. The number of boards is generally more than 10, and PBGA products even reach more than 20. The number of internal positioning holes in each board is large. If the milling process adopts the same processing method as PCB: Drill positioning holes on backing plate and bakelite board-upper pin-manual board-up-processing-manual board-down. However, because different backing plates and corresponding product boards all use the same bakelite board, therefore, when changing another specification or another backing board, it is necessary to drill positioning holes on the bakelite board again, and t...

AI Technical Summary

Problems solved by technology

However, because different backing plates and corresponding product boards all use the same bakelite board, therefore, when changing another specification or another backing board, it is necessary to drill positioning holes on the bakelite board again, and the new positioning holes are the same as the original ones. The positioning holes may partially overlap. Installing pins on such newly drilled positioning holes will cause the pins to tilt and not be perpendicular to the top surface of the bakelite board, which will bring difficulties to the operation of the upper and lower boards, resulting in time-consuming operation of the upper and lower boards. It is too long, which seriously affects the processing efficiency, and the thin feature of PKG products makes the uneven force of the operator during the process of going up and down the board, and it is easy to cause damage to the positioning hole, resulting in scrap; Re-drill the positioning holes and re-install the pins, which seriously reduces the efficiency of the board-up operation. When the board is removed manually, the board needs to be removed by picking. The efficiency of the board-down is low, and it is easy to cause damage and scrapping of the package substrate. situation

[0003] At present, the equipment supply business community has not designed a milling shape loading and unloading machine for PKG products. Using PCB shape processing methods to produce PKG products is very inefficient and prone to damage.

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