Wiring member, its manufacturing method, and manufacturing method of wiring member bonded body
A technology of wiring components and manufacturing methods, applied in the direction of manufacturing tools, conductors, welding media, etc., can solve problems such as corrosion of seals, adverse effects of long-term reliability, etc.
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[0137] Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. In addition, unless otherwise specified, "part" and "%" are based on mass. In addition, the average thickness of the conductive material and the wiring member was measured with a micrometer at five locations, and the arithmetic mean thereof was obtained.
[0138]
[0139] (manufacturing of conductive parts)
[0140] As the conductive material, Cu material (purity: 99.99%) was rolled to produce a rectangular linear conductive material with a width of 1.5 mm and an average thickness of 0.2 mm.
[0141] (Preparation of non-eutectic solder material)
[0142] Figure 7 An outline of a hot-dip plating facility 21 as an apparatus for manufacturing the wiring member of the present invention is shown. The composition of the solder alloy of the coated conductive member of the wiring member of the present invention can be changed by adding to Figure 7 T...
Embodiment 2
[0166] In Example 1, the composition of the solder alloy used in the production of the wiring member was changed from 10 parts of tin and 90 parts of lead to 20 parts of tin and 80 parts of lead, and a solder coating layer containing a non-eutectic solder material was produced and formed. The wiring member 2 was used, and it carried out similarly to Example 1, and evaluated the adhesiveness at each bonding temperature. In addition, as a result of examining the cooling curve of the non-eutectic solder material of the wiring member 2 obtained, the liquidus temperature was 280°C and the solidus temperature was 183°C. The results are shown in Table 1.
Embodiment 3
[0168] In Example 1, the composition of the solder alloy used in the production of the wiring member was changed from 10 parts of tin and 90 parts of lead to 30 parts of tin and 70 parts of lead, and a solder coating layer containing a non-eutectic solder material was produced and formed. In the same manner as in Example 1 except that the wiring member 3 was used, the evaluation of the adhesiveness at each bonding temperature was performed. In addition, as a result of examining the cooling curve of the non-eutectic solder material of the wiring member 3 obtained, the liquidus temperature was 255°C and the solidus temperature was 183°C. The results are shown in Table 1.
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Abstract
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