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Joint module

A technology of modules and snap-fit ​​components, which is applied in the direction of instruments, electrical digital data processing, and digital data processing parts, etc., which can solve problems such as deformation and warping, insufficient strength of joints, and inaccurate alignment of the two shells.

Active Publication Date: 2014-04-16
ACER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the light and thin and multiple designs are combined, the new problem encountered is that the two shells cannot be aligned accurately when they are horizontally docked, and due to the insufficient strength of the connection, deformation and warping are prone to occur

Method used

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Embodiment Construction

[0055] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

[0056] Figure 1A It is a schematic diagram of an assembled joint module according to an embodiment of the present invention. see Figure 1A , the bonding module 100 of this embodiment includes a first housing 110 and a second housing 120 . In this embodiment, the first housing 110 can be an expansion base, and the first housing 110 includes a first connection port 116 a and an input and output port 116 b. The input and output ports 116b are electrically connected to the first connection port 116a, and can be used for users to insert an external device (not shown). The second housing 120 can be an expansion module, such as a keyboard module, a tablet, or an audio-visual module (such as a speaker, etc.).

[0057] The second casing 120 includes a second connect...

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PUM

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Abstract

The invention relates to a joint module. The joint module comprises a first shell and a second shell. The first shell comprises a first body, an accommodating groove, a track and a jacking piece. The track is communicated with the accommodating groove. The depth of the track in one axial direction is larger than the depth of the accommodating groove in the axial direction. The jacking piece is fixed in the accommodating groove. The second shell comprises a second body, a linkage piece, a gear set and a joining arm. The linkage piece comprises a first rack. The joining arm comprises a second rack. The first rack and the second rack are respectively meshed with the gear set, wherein the gear set is connected to the second body in a pivotal mode. When a part of the second shell stretches into the accommodating groove of the first shell in the axial direction, the jacking piece of the first shell pushes the linkage piece, the first rack moves to drive the gear set to rotate, and the second rack moves correspondingly so as to make the joining arm stretch into the track of the first shell. The joint module is convenient to operate, and the rigidity and strength of a joint when the first shell and the second shell are in horizontal butt joint can be effectively improved and reinforced.

Description

technical field [0001] The invention relates to a bonding module, and in particular to a bonding module with better bonding strength. Background technique [0002] At present, consumer electronic products tend to be designed in a thinner and more diverse direction. In terms of thin and light design, the thickness and size of the internal electronic components, mechanism structure and shell are usually reduced to reduce the appearance thickness of the product. However, the subsequent problem is that when the thickness of the product is reduced, its overall structural rigidity will also decline, which not only affects the reliability of the product, but also reduces the strength and life of the product. [0003] A common solution is to replace the plastic material with metal or carbon fiber for the structure or shell of the product to increase rigidity. However, replacement materials must face problems such as increased cost, increased weight, and blocked antenna reception. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16
Inventor 黄昱诚庄少棋
Owner ACER INC