A single crystal silicon silicon wafer cleaning and texturing process

Abstract

The invention relates to a cleaning and wool making technology for a monocrystal silicon chip, and belongs to the technical field of chemical engineering. The technology particularly comprises the following step: (1) adopting a self-made silicon chip cleaning agent to perform precleaning on the silicon chip; (2) putting the pre-cleaned silicon chip into a wool making trough; preparing a wool making liquid in the wool making trough, and adding 0.1 to 5% of sodium hydroxide, 0.1 to 3% of potassium hydroxide, 1 to 5% of isopropyl alcohol and 0.02 to 5% of a self-made wool making additive in percentage by weight into the wool making liquid; rising temperature until the reaction temperature is 70 DEG C to 90 DEG C to make wool; turning on ultrasonic equipment during the wool making process; (3) when the wool is prepared, closing the trough body; before the chip is cast, stirring by adopting a stirring device, wherein the wool making reaction time is 15 to 40 min. According to the invention, through the adoption of the cleaning agent and the wool making additive, the technology is controlled to be simple and stable, the energy consumption is reduced, and the capability of process control is enhanced, so that the control quality of the product in various aspects is greatly improved, the production cost in various aspects is reduced, and the comprehensive economic benefit is increased.

Description

technical field [0001] The invention relates to a single crystal silicon wafer cleaning and texturing process, which belongs to the technical field of chemical processes. Background technique [0002] A silicon wafer is a silicon material that is cut into pieces by processing. Therefore, the silicon material to the usable silicon wafer has to go through multiple processes such as cutting and cleaning. With the development of society, silicon wafers are used more and more, and the processing of silicon wafers has also received more attention. Cleaning is one of the production processes of silicon wafers, and its cleaning quality has a great influence on the performance of silicon wafers. The main purpose of cleaning is to clean away the sand particles, residual cutting abrasives, metal ions and fingerprints generated during the cutting process, so that the surface of the silicon wafer can achieve technical indicators such as no corrosion, oxidation, and no residue. Traditi...

AI Technical Summary

Problems solved by technology

Its disadvantages are: long time for texturing, large and uneven texturing pyramid, high surface state of the original silicon wafer, relatively large chemical consumption, short solution life, poor texturing repeatability, volatile amount of isopropanol, etc. It is very large, needs to be adjusted continuously, and the operation is difficult, which leads to problems such as high defect rate of texturing appearance and low conversion efficiency of cells

The existing texturing liquid and its texturing process have the following problems: (1) The amount of silicon wafer texturing thinning is large, the cell fragment rate is high, and the warpage is large

(2) The texturing effect is unstable, and the yield is difficult to control

(3) The pyramid on the silicon surface after texturing is too large and the uniformity is poor, which is not conducive to the uniformity of the diffusion junction depth in the subsequent channel and the contact between metal and silicon in the silk screen printing process