Film sticking mechanism and film sticking method
A film sticking mechanism and film sticking technology, applied in chemical instruments and methods, conveyor objects, lamination auxiliary operations, etc., can solve the problems of rising equipment costs, complicated control, and many parts of the automatic film sticking mechanism, so as to control equipment costs, mechanical Simple structure and the effect of shortening the bonding time
Inactive Publication Date: 2017-02-01
FU TAI HUA IND SHENZHEN +1
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Problems solved by technology
At present, there are also good film sticking mechanisms with multiple suction heads on the market. However, they control the bonding action of each suction head through a complex mechanical structure design, such as a multi-cylinder power structure, which leads to a large number of parts in the automatic film sticking mechanism and complicated control. increase equipment cost
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[0054] see figure 1 , which is a schematic perspective view of a preferred embodiment of the film pasting mechanism 1 of the present invention. The film pasting mechanism 1 includes a laminating device 10 , a driving and transmission device 20 , and a connecting plate 30 connecting the laminating device 10 and the driving and transmission device 20 .
[0055] Please also refer to figure 2 and image 3 , figure 2 viewed from one side figure 1 The three-dimensional exploded view of the shown film sticking mechanism 1, image 3 is viewed from the other side figure 1 The three-dimensional exploded view of the film pasting mechanism 1 shown. The bonding device 10 has a plurality of suction heads 180, and the plurality of suction heads 180 of the bonding device 10 take out materials at the same time at the material taking position, and each suction head 180 is realized at the bonding position under the drive of the driving and transmission device 20. Separate the film separ...
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The invention relates to a film sticking mechanism and a film sticking method thereof. The film sticking mechanism includes a laminating device and a driving and transmission device, and the laminating device includes n suction heads, where n is not less than 2. The driving and transmission device drives the bonding device to reciprocate along the Z axis. When the bonding device moves back and forth along the Z axis, the abutment pawl of the driving and transmission device and (n+1) cam rollers of the bonding device sequentially abut and push the transmission part of the bonding device to rotate, and every A cam roller drives the transmission part to rotate 360 / (n+1) degrees, and the (n+1) single-tooth dials of the fitting device mesh with (n+1) racks in sequence to drive (n +1) The racks move along the Z axis in sequence and are pushed out for a certain distance. When the empty racks are pushed out, the n suction heads do not protrude, and the suction action can be completed. When other n racks with corresponding suction heads When being pushed out in sequence, the n suction heads are stretched out in sequence, thereby completing the film sticking action of each suction head in sequence.
Description
technical field [0001] The invention relates to a film sticking mechanism and a sticking method. Background technique [0002] Generally, the industry uses a film-attaching mechanism to attach film-type gaskets to predetermined positions on the motherboard. The film sticking mechanism adopted by the industry is divided into a single-suction head film sticking mechanism and a multi-suction head film sticking mechanism. The single-suction head film sticking mechanism has a suction head, which absorbs and peels the film gasket to be bonded from the material belt of the film gasket at the pick-up position, and then moves the suction head to the position to be bonded on the main board for bonding action. However, the film sticking mechanism with a single suction head needs to go back to the pick-up position to take the material after each sticking, so as to carry out the next sticking action. In this way, bonding efficiency is low. At present, there are also good film stickin...
Claims
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IPC IPC(8): B65B33/02
CPCB65G47/914B65G47/918B32B38/18
Inventor 陈清化雷斌斌廖文涛
Owner FU TAI HUA IND SHENZHEN