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Multilayer circuit board and method for manufacturing same

A multi-layer circuit board and outer layer technology, which is applied in the direction of multi-layer circuit manufacturing, printed circuit components, electrical connection printed components, etc., can solve the problem of increasing the production cost of multi-layer circuit boards, high price, damage to multi-layer circuit boards, etc. problem, to achieve the effect of reducing test cost and detection cost, and simple test equipment

Active Publication Date: 2014-05-14
LEADING INTERCONNECT SEMICON TECH SHENZHEN CO LTD +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, electric test fixtures and X-ray detectors are more expensive, which will make the test cost of multilayer circuit boards higher; and slicing will cause destructive damage to multilayer circuit boards, resulting in waste, which in turn increases the cost of multilayer circuit boards. The production cost of multilayer circuit board

Method used

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  • Multilayer circuit board and method for manufacturing same
  • Multilayer circuit board and method for manufacturing same
  • Multilayer circuit board and method for manufacturing same

Examples

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Embodiment Construction

[0022] The multilayer circuit board provided by the technical solution and its manufacturing method will be further described in detail below in conjunction with the drawings and embodiments.

[0023] The manufacturing method of the multilayer circuit board provided by the embodiment of the technical solution includes the following steps:

[0024] For a first step, see Figure 1-3 , providing an inner core board 100 .

[0025] In this embodiment, a two-layer inner core board 100 is taken as an example for illustration. The inner core board 100 includes a first inner conductive circuit layer 14 , a second insulating layer 15 and a second inner conductive circuit layer 16 stacked in sequence.

[0026] The inner core board 100 is formed with a product part 20 and a non-product part 22 other than the product part 20. The non-product part 22 includes a test area 21. In this embodiment, the test area 21 is located in the inner The board edge position of the layer core board 100. ...

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Abstract

Provided is a multilayer circuit board which comprises a first external conductive line layer, at least one internal conductive line layer, and a second external conductive line layer which arranged successively. A testing region is formed on the multilayer circuit board. Multiple conductive testing holes are formed in the testing region. Each of the conductive testing holes passes through the first external conductive line layer and the second external conductive line layer and electrically connects the first external conductive line layer with the second external conductive line layer. Each of the conductive testing holes is spaced apart from the at least one internal conductive line layer via an insulating material. Two adjacent conductive testing holes are mutually and electrically connected through a connection wire formed on the first external conductive line layer or the second external conductive line layer such that a hole chain is formed by the multiple conductive testing holes. The invention also provides a method for manufacturing the above multilayer circuit board.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a multilayer circuit board and a manufacturing method thereof. Background technique [0002] With the development of electronic products in the direction of miniaturization and high speed, circuit boards are also developing from single-sided circuit boards and double-sided circuit boards to multi-layer circuit boards. A multi-layer circuit board refers to a circuit board with multiple layers of conductive circuits, which has more wiring area and higher interconnection density, so it is widely used. At present, multilayer circuit boards are usually produced by a build-up method, that is, they are produced in a manner of stacking layers. The method for manufacturing a multi-layer circuit board by using the traditional build-up method includes the following steps: the first step is to manufacture an inner layer board, and the inner layer board includes at least one insulati...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11H05K3/46
Inventor 陈建志刘金鹏吴唐仪
Owner LEADING INTERCONNECT SEMICON TECH SHENZHEN CO LTD
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