Soldering flux for improving film-forming property
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A technology of film-forming performance and flux, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., to achieve the effect of environmental protection, convenient transportation and improved performance
Inactive Publication Date: 2014-05-21
SUZHOU LOTTE CHEM TECH
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However, in the water-based no-clean flux system reported so far, there are few systematic studies on the influence of the film-forming agent on the performance of the flux, and there are few reports on the film-forming mechanism. There are also few researches on the selection and quantitative configuration of the flux ratio to optimize the flux performance
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[0051] Flux 100g, by mass, including 10 parts of activator (2 parts of glutaric acid, 4 parts of DL-malic acid, 2 parts of methyl succinic acid, 2 parts of itaconic acid); 4 parts of surfactant (fatty acid methyl 2 parts of ester ethoxylate, 2 parts of isomeric tridecyl alcohol ethoxylate); 0.5 parts of co-solvent (a mixture of acetamide, amide and ethylene glycol butyl ether in a mass ratio of 1:1:1 ); 0.08 parts of corrosion inhibitor (a mixture of benzotriazole BTA and benzimidazole BIA with a mass ratio of 1:1); 1-4 parts of antioxidants (0.5 parts of tert-butyl hydroquinone, tetra 0.5 parts of chloroisophthalonitrile); the balance is deionized water; 0.2-2 parts of film-forming agent.
[0052] Weigh the raw materials of each component according to the weight ratio, add them to the enamel kettle in turn according to the above-mentioned production method of the flux, stir, mix evenly, stand and filter to obtain the finished flux.
[0053] The above-mentioned fluxes are mar...
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Abstract
The invention discloses soldering flux for improving the film-forming property. The soldering flux is prepared from 10-20 parts of activating agent, 2-6 parts of surface active agent, 0.3-0.8 part of cosolvent, 0.2-2 parts of film-forming agent, 0.04-0.09 part of corrosion inhibitor, 1-4 parts of antioxidant and the balance of deionized water, wherein the film-forming agent is prepared from at least one of PEG-1000, PEG-2000, PEG-4000 and PEG-6000, the surface active agent is prepared from at least one of FMEE and lutensol to (3,5,7,9) compounds, BTA and BIA are mixed to form the corrosion inhibitor, the antioxidant is prepared from at least one of tertiary butylhydroquinone, triclosan, tetrachloroisophthalonitrile and allicin, and the activating agent is prepared from at least two of glutaric acid, DL-malic acid, methylsuccinic acid and itaconic acid. With the method, the soldering flux for improving the film-forming property has the advantages of being free of halogen, low in residue, free of washing, environmentally friendly and the like.
Description
technical field [0001] The invention relates to the field of flux, in particular to a flux for improving film-forming performance. Background technique [0002] With the increasing application range of high-density, high-performance, lightweight, and miniaturized electronic products, the enhancement of people's awareness of environmental protection and the restrictions of relevant laws and regulations, it is necessary to develop and develop new rosin-free and halogen-free materials that are used in conjunction with lead-free materials. VOC-free water-based no-clean flux has become an important task in the research field of microelectronic packaging materials. This type of flux is mainly composed of activators, solvents, surfactants, film formers, additives, etc. As an important part of the flux, the film-forming agent is added to help form a dense organic film after soldering to protect the solder joints and the substrate, thus having certain anti-corrosion properties, and ...
Claims
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