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Modification agent for tin-silver-copper solder or tin-copper solder smelting and using method

A modification agent, tin-silver-copper technology, applied in the field of modification agent for tin-silver-copper solder or tin-copper solder smelting, can solve problems affecting the reliability of alloy solder joints, etc., to improve uneven shrinkage, small size, and improve modification efficiency Effect

Active Publication Date: 2015-09-02
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the existence of Ag in the microstructure of the alloy, which is prone to one-dimensional growth 3 Sn intermetallic compound, which affects the reliability of the alloy as a solder joint, especially its impact resistance

Method used

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  • Modification agent for tin-silver-copper solder or tin-copper solder smelting and using method
  • Modification agent for tin-silver-copper solder or tin-copper solder smelting and using method
  • Modification agent for tin-silver-copper solder or tin-copper solder smelting and using method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032]A modifier used for smelting SnAgCu solder (the weight ratio of Ag in the solder is 3%, the weight ratio of Cu is 0.5%, and the rest is Sn), wherein the weight percentage of Co is 7%, the rest is Cu, and the particle size of alloy powder The diameter is 10 μm. Cool the SnAgCu solder from the melting temperature of 500°C to 300°C and keep it warm. Before casting or powder spraying, add the modified agent powder and the SnAgCu solder in a weight ratio of 1:100, and apply a frequency of 50KHz and a magnetic field strength of 6kA / m. Stir with an alternating magnetic field, and remove the modifier after 5 minutes for casting or powder spraying.

Embodiment 2

[0034] A modifier used for smelting SnAgCu solder (the weight ratio of Ag in the solder is 3%, the weight ratio of Cu is 0.5%, and the rest is Sn), wherein the weight percentage of Co is 8%, the rest is Cu, and the particle size of alloy powder The diameter is 20 μm. Cool the Sn-3%Ag-0.5%Cu solder from the melting temperature of 500°C to 290°C and keep it warm, and add the modifier powder and the Sn-3%Ag-0.5%Cu solder according to the weight ratio of 1 before casting or powder spraying. : 100 mixed, and applied frequency is 50KHz, the alternating magnetic field of magnetic field intensity 6kA / m is stirred, and after 5 minutes, removes modificator and carries out casting or powder spraying.

Embodiment 3

[0036] A modifier used for smelting SnAgCu solder (the weight ratio of Ag in the solder is 3%, the weight ratio of Cu is 0.5%, and the rest is Sn), wherein the weight percentage of Co is 9%, the rest is Cu, the grain size of alloy powder The diameter is 50 μm. Cool the SnAgCu solder from the melting temperature of 500°C to 280°C and keep it warm. Before casting or powder spraying, add the modifier powder and Sn-3%Ag-0.5%Cu solder according to the weight ratio of 1:100, and apply the frequency of 60KHz, alternating magnetic field with a magnetic field strength of 6kA / m is used for stirring, and after 5 minutes, the modifier is removed for casting or powder spraying.

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Abstract

The invention discloses a modifier for smelting a Sn-Ag-Cu solder or a Sn-Cu solder. The modifier is Cu-Co alloy powder and is prepared from the components in percentage by weight: 7-9 percent of Co and the balance of Cu, wherein the particle size of the alloy powder is 10-100 microns. With the adoption of the modifier, the crystal morphologies and distribution of intermetallic compounds such as Ag3Sn, Cu6Sn5 and the like can be improved. Meanwhile, the invention also provides a using method of the modifier. The using method comprises the steps: cooling the smelting temperature of the Sn-Ag-Cu solder or the Sn-Cu solder from 500 DEG C to 280-300 DEG C, adding the modifier before casting or powder spraying, applying an alternating magnetic field, mixing a mixed liquid of the solder and the modifier for 5-10m, removing the modifier, and carrying out casting or powder spraying on the solder, wherein the weight ratio of the modifier to the Sn-Ag-Cu solder or the Sn-Cu solder is 1:100. With the adoption of the using method, on the one hand, the modification efficiency can be improved; and on the other hand, uneven shrinkage of the solder is improved, and in addition, soldering powder with more uniform size and high sphericity can be obtained.

Description

technical field [0001] The invention belongs to the field of low-temperature alloy smelting and soldering materials, and in particular relates to a modifier used for smelting tin-silver-copper solder or tin-copper solder and a use method thereof. Background technique [0002] Tin-silver-copper (SnAgCu) solder is currently the mainstream lead-free solder alloy. However, due to the existence of Ag in the microstructure of the alloy, which is prone to one-dimensional growth 3 Sn intermetallic compounds affect the reliability of the alloy as a solder joint, especially its impact resistance. In addition, with the development of low-silver solder, the alloy composition deviates from the eutectic, and microscopic uneven shrinkage and segregation will occur when the material is solidified, and Cu 6 sn 5 Uneven distribution of compounds. [0003] Reference patent 1 (patent number: CN01131644.6, date of publication is July 9, 2003, publication number is the Chinese patent of CN142...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/02C22C9/06
Inventor 周健罗登俊陶卫建陈旭薛烽白晶
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU
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