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Board inspection method

一种基板检查、基板的技术，应用在测量装置、仪器、通过光学手段进行材料分析等方向，能够解决检查错误等问题，达到防止检查错误、防止出现的效果

Inactive Publication Date: 2014-05-21
KOHYOUNG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0007] However, in the case of this method, due to the influence of surrounding conditions such as the interference of ambient light or the mutual interference of adjacent parts, there will be a problem of inspection errors, and inspections will also occur when the solder joint does not have a general shape. wrong situation

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Embodiment Construction

[0032] The present invention can achieve various changes and can have various forms. Specific embodiments thereof are illustrated in the drawings below and described in detail in this specification. However, the present invention is not limited to a specific disclosure method, and all changes, equivalent technical solutions and replacement technical solutions within the thought and technical scope of the present invention shall be included.

[0033] Terms such as first and second can be used to describe various structural elements, but the above structural elements are not limited to the above terms. The purpose of the above terms is only to distinguish one structural element from another structural element. For example, within the protection scope of the present invention, a first structural element can be named as a second structural element, and likewise, a second structural element can also be named as a first structural element.

[0034] The terms used in the present app...

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Abstract

The invention provides a board inspection method. In order to inspect a board, first, an inspection area including a solder joint is provided with a first light having a first color, a second light having a second color and a third light having a third color at a first inclination angle, a second inclination angle smaller than the first inclination angle and a third inclination angle smaller than the second inclination angle with respect to the board, respectively. Then, a color image of the inspection area is acquired according to the first light, the second light and the third light provided to the inspection area. Thereafter, it is inspected whether the solder joint is good or bad by using a color distribution in the color image. Then, the inspection result is verified by using pre-measured height information of the solder joint. Thus, an inspection error may be prevented.

Description

technical field [0001] The present invention relates to a substrate inspection method, and more particularly to a substrate inspection method for inspecting solder joints of a substrate. Background technique [0002] Usually, at least one printed circuit board (PCB) is provided in the electronic device, and the printed circuit board is equipped with circuit patterns, connection pads, driver chips electrically connected to the connection pads, etc. circuit components. [0003] Circuit components such as the driver chip are mounted on the printed circuit board using solder. In order for the above-mentioned circuit components to operate normally on the above-mentioned printed circuit board, the above-mentioned circuit components should be correctly mounted on the above-mentioned printed circuit board, for which an inspection device for inspecting whether the above-mentioned circuit components are defectively mounted is used. [0004] The above-mentioned inspection devices gen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/02
CPCG01N21/956G01N2021/8845G01N2021/95646G01B11/0608H05K13/0817
Inventor 郑仲基
Owner KOHYOUNG TECH
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