Wafer pre-alignment method and apparatus
A pre-alignment, wafer technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as reduced efficiency, wafer pre-alignment errors, and difficulty in ensuring accuracy, reducing measurement data, eliminating Principle error, the effect of eliminating error
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[0053] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0054] refer to figure 1 As shown, the present invention discloses a wafer pre-alignment device, which includes: a base 1, a suction cup assembly 2, a support assembly 3, a light source 4, and a CCD sensor 5, wherein:
[0055] The machine base 1 is provided with a driving device and a mechanism, which can drive the suction cup assembly 2 to rotate around its center line for lifting movement, and can also translate along the X and Y axes of the coordinate system.
[0056] Cooperate figure 2 , 3 As shown, the suction cup assembly 2 includes a suction cup shaft 21 and a suction cup contact unit 22...
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