A kind of copper substrate surface coating structure and preparation method thereof
A copper substrate and coating technology, applied in chemical instruments and methods, metal material coating technology, coating, etc., can solve the problem of products being easily burnt, so as to save the electrochrome plating process, shorten the process flow, simplify The effect of the production process
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Embodiment 1
[0030] A coating structure on the surface of a copper substrate, the structure of which starts from the copper substrate layer is a watt nickel layer with a thickness of 0.5 μm, a semi-gloss nickel layer with a thickness of 10 μm, a PVD corrosion-resistant alloy layer with a thickness of 0.5 μm, and corrosion resistance The alloy can be a zirconium-silicon alloy (zirconium-silicon atomic composition is zirconium 98 silicon 2), a PVD color layer with a thickness of 0.3 μm, and the color layer is zirconium nitride.
[0031] A preparation method of a copper substrate surface coating structure is as follows:
[0032] The first step is the pretreatment of the copper substrate: chemical wax removal and oil removal → electrolytic degreasing → activation; the pretreatment of the copper substrate is carried out in accordance with the currently known treatment methods for chemical wax removal and oil removal, electrolytic degreasing and activation. The material refers to the base materi...
Embodiment 2
[0042] A coating structure on the surface of a copper substrate, the structure of which starts from the copper substrate layer is a watt nickel layer with a thickness of 3 μm, a semi-gloss nickel layer with a thickness of 3 μm, a PVD corrosion-resistant alloy layer with a thickness of 2 μm, and the corrosion-resistant alloy can be It is a chromium-silicon alloy (zirconium-silicon atomic composition is chromium 98 silicon 2), PVD color layer with a thickness of 0.1 μm, and the color layer is zirconium carbide nitrogen.
[0043] A preparation method of a copper substrate surface coating structure is as follows:
[0044] The first step is the pretreatment of the copper substrate: chemical wax removal and oil removal → electrolytic degreasing → activation; the pretreatment of the copper substrate is carried out in accordance with the currently known treatment methods for chemical wax removal and oil removal, electrolytic degreasing and activation. The material refers to the base m...
Embodiment 3
[0055] A coating structure on the surface of a copper substrate, the structure of which starts from the copper substrate layer is a watt nickel layer with a thickness of 1 μm, a semi-gloss nickel layer with a thickness of 4 μm, a PVD corrosion-resistant alloy layer with a thickness of 1 μm, and the corrosion-resistant alloy can be It is a chromium-silicon alloy (the atomic composition of chromium and silicon is chromium 50 silicon 50), PVD color layer with a thickness of 0.2 μm, and the color layer is zirconia.
[0056] A preparation method of a copper substrate surface coating structure is as follows:
[0057] The first step is the pretreatment of the copper substrate: chemical wax removal and oil removal → electrolytic degreasing → activation; the pretreatment of the copper substrate is carried out in accordance with the currently known treatment methods for chemical wax removal and oil removal, electrolytic degreasing and activation. The material refers to the base material...
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