variable scale fin radiator
A radiator and fin technology, applied in the field of variable-scale fin radiators, can solve problems such as affecting working performance, burning, and temperature rise of electronic devices, and achieves the improvement of adaptability, reduction of power consumption, and improvement of heat dissipation capacity. Effect
Active Publication Date: 2016-05-18
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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Problems solved by technology
When the heat load of the electronic device changes suddenly, the heat dissipation of the fin radiator cannot meet the requirements of the electronic device, which will lead to a sharp rise in the temperature of the electronic device, affecting its working performance or even burning out
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[0031] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values within acceptable error margins or design constraints. The directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the...
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The invention provides a ribbed radiator with the changeable dimension. The ribbed radiator with the changeable dimension comprises a ribbed radiator body. The ribbed radiator body comprises a body, a plurality of ribs fixed on the body, and a plurality of fins fixed on the ribs respectively. The fins are formed by preparing shape memory alloy materials. The ribs and the fins are trained, the thickness T of the ribs when the temperature is larger than the preset temperature is larger than the thickness of the ribs when the temperature is smaller than the preset temperature, and an angle alpha 2 between the plane where the fins are located and the plane where the ribs are located is larger than an angle alpha 1 between the plane where the fins are located and the plane where the ribs are located when the temperature is smaller than the preset temperature. In comparison with a traditional radiator made of copper or aluminum, the heat dissipating area of the ribbed radiator with the changeable dimension and the convective heat transfer coefficient of the air side can be adjusted according to the density of heat flow of an electron device, and the heat dissipating ability of the radiator is improved.
Description
technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to a variable-scale fin radiator. Background technique [0002] As the power of electric, electronic, and optoelectronic devices (hereinafter referred to as electronic devices) increases, the heat generated is increasing. It is difficult to release the heat to the surrounding environment only by the surface area of these devices. Therefore, it is necessary to use various Form of heat sink to increase the heat dissipation area of electronic devices. Heat sinks are usually made of materials with good thermal conductivity such as copper or aluminum. [0003] figure 1 It is a schematic diagram of a fin radiator in the prior art. Please refer to figure 1 , the electronic device is placed in the middle of the fin radiator, the electronic device is tightly combined with the fin radiator through thermal grease, the heat of the electronic device is tran...
Claims
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IPC IPC(8): H05K7/20
Inventor 姜玉雁王涛唐大伟
Owner INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI