Methods and apparatus for packages with interposers

Abstract

Methods and apparatus for encapsulating an interposer with a barrier for a die are disclosed. The interposer may include a metal layer overlying the substrate. One or more barriers may be formed over the metal layer. The barrier surrounds an area that is larger in size than a die that can be connected to the contact pads over the metal layer within the area. The barrier may comprise conductive material or non-conductive material, or both. The underfill may be formed under the die, above the metal layer and contained in the area surrounded by the dam, so that the underfill does not overflow outside the area surrounded by the dam. Another package may be placed over the die connected to the interposer to form a package-on-package structure.

Description

technical field [0001] The present invention relates to packaging of semiconductor devices, and more particularly, to methods and apparatus for packaging with interposers. Background technique [0002] Since the invention of the integrated circuit (IC), the semiconductor industry has experienced rapid development due to the increasing integration density of various electronic components (ie, transistors, diodes, resistors, capacitors, etc.). In most cases, this increase in integration density stems from the continuous reduction in minimum feature size, which allows more components to be integrated in a given area. These smaller electronic components also require smaller packages that use less area than previous packages. Some of the smaller types of packages used for semiconductor devices include quad flat pack (QFP), pin grid array (PGA), ball grid array (BGA), flip chip (FC), three-dimensional integrated circuit (3DIC), Wafer-level package (WLP) and package-on-package (P...

AI Technical Summary

Problems solved by technology

However, the underfill material can overflow or seep into the connectors such as BGA balls, causing the interposer to warp and destroy the electrical connection

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