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Manufacturing method of light-emitting diode light-emitting device

A technology for light-emitting diodes and light-emitting devices, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of total reflection, light energy loss, etc., to improve the light transmission rate, higher light utilization rate, and reduce a large number of total reflection phenomena. Effect

Inactive Publication Date: 2016-11-30
中山市云创知识产权服务有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

When the light emitted by the light-emitting diode chip is transmitted through the package and directed to the light incident surface of the light guide plate, when the light is emitted from the light-emitting surface of the package to the air outside the package, the light is transmitted from the optically denser medium to the optically thinner medium. Therefore, part of the light that reaches the interface between the light-emitting surface of the package body and the air will produce total reflection, so that the light emitted by the LED chip cannot be completely emitted and enters the interior of the light guide plate, resulting in loss of light energy

Method used

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  • Manufacturing method of light-emitting diode light-emitting device
  • Manufacturing method of light-emitting diode light-emitting device
  • Manufacturing method of light-emitting diode light-emitting device

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Embodiment Construction

[0016] The manufacturing method of the light-emitting diode light-emitting device provided by the embodiment of the present invention includes the following steps.

[0017] first step, see figure 1 , providing an optical element 10 comprising a groove 11 .

[0018] The optical element 10 can be a diffusion plate, a lens or a light guide plate, etc., and the number of grooves 11 of the optical element 10 can be single or multiple. see figure 1 , in this embodiment, the optical element 10 is a light guide plate including a plurality of grooves 11, and the plurality of grooves 11 are a plurality of blind holes formed on the light incident side 100 of the light guide plate.

[0019] The second step, see figure 2 , filling the transparent adhesive material 20 into the groove 11 of the optical element 10 .

[0020] The method of dispensing glue can be adopted here, and the syringe 30 of the glue dispensing machine is used to inject the transparent glue material 20 into the groo...

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Abstract

A method for manufacturing a light-emitting diode light-emitting device, comprising steps: the first step, providing an optical element containing a groove; the second step, filling the groove of the optical element with transparent glue; the third step, providing a The light source of the diode; and the fourth step, embedding the light emitting diode of the light source into the groove of the optical element, and discharging the air between the light emitting diode and the transparent adhesive. The method can reduce the total reflection phenomenon that occurs during the incident light from the LED light source to the optical element, so as to minimize the loss of light energy and improve the light utilization efficiency of the LED lighting device.

Description

technical field [0001] The invention relates to a method for manufacturing a light emitting device, in particular to a method for manufacturing a light emitting device with a light emitting diode light source. Background technique [0002] Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, it has been increasingly used in In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights. [0003] In the production of existing light emitting devices, light emitting diodes and light guide plates are usually used to construct light emitting diode light emitting devices. The light guide plate includes a light incident surface, and the light emitting diodes are opposite to the light incident surface of the light guide plate and arranged at intervals. The light-emitting diode generally inclu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48
Inventor 蔡明达张忠民徐智鹏
Owner 中山市云创知识产权服务有限公司
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