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Transparent conductive substrate and manufacturing method thereof

A technology of transparent conduction and manufacturing method, which is applied in the direction of cable/conductor manufacturing, conductive layer on insulating carrier, circuit, etc., which can solve problems such as difficult to use single-piece touch glass and easy to break, so as to improve strength and reduce quantity Effect

Inactive Publication Date: 2017-12-12
SCIENBIZIP CONSULTINGSHENZHENCO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The glass substrate is generally made of ordinary plain glass. Because the surface of ordinary plain glass has fine cracks of different sizes, the glass is easily broken when subjected to external force, and it is not easy to use as a single-piece touch glass.

Method used

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  • Transparent conductive substrate and manufacturing method thereof
  • Transparent conductive substrate and manufacturing method thereof

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Embodiment Construction

[0015] Such as figure 1 As shown, a transparent conductive substrate 100 provided by an embodiment of the present invention includes a glass substrate 10 , a transparent conductive adhesive 20 and an anti-reflection layer 30 .

[0016] The glass substrate 10 is made of ordinary frosted glass, and its refractive index varies according to its composition. The glass substrate 10 includes an upper surface 11 , a lower surface 12 opposite to the upper surface 11 , and a side surface 13 connected between the upper surface 11 and the lower surface 12 . A strip-shaped groove 111 is formed on at least one of the upper surface 11 or the lower surface 12 according to the direction of the pre-designed conductive circuit. The width of the strip groove 111 on the surface of the glass substrate 10 along the direction perpendicular to the extension of the strip groove 111 is greater than 100 nm and less than 500 nm. When the width is less than 100 nm, it may not be able to meet the requirem...

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Abstract

The invention provides a transparent conductive substrate, which includes a glass substrate and a transparent conductive adhesive. A strip-shaped groove is provided on one surface of the glass substrate according to the direction of the pre-designed conductive circuit. The transparent conductive glue is filled in the strip grooves to form conductive lines in the glass substrate. The transparent conductive substrate and its manufacturing method provided by the present invention open a strip-shaped groove according to a pre-designed conductive circuit on the glass substrate, and fill the transparent conductive glue into the strip-shaped groove to form a conductive circuit, thereby reducing The number of cracks on the surface of the glass substrate effectively improves the strength of the transparent conductive substrate. The invention also provides a manufacturing method of the transparent conductive substrate.

Description

technical field [0001] The invention relates to a substrate, in particular to a transparent conductive substrate and a manufacturing method of the transparent conductive substrate. Background technique [0002] A traditional transparent conductive substrate includes a glass substrate and a transparent conductive layer arranged on the glass substrate. The glass substrate is generally made of ordinary plain glass. Since the surface of the ordinary plain glass has fine cracks of different sizes, the glass is easily broken when subjected to external force, and is not easy to be used as a single-piece touch glass. Contents of the invention [0003] In view of this, it is necessary to provide a transparent conductive substrate capable of improving strength and a manufacturing method of the transparent conductive substrate. [0004] A transparent conductive substrate includes a glass substrate and a transparent conductive glue. A strip-shaped groove is provided on one surface o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14H01B13/00
Inventor 骆世平
Owner SCIENBIZIP CONSULTINGSHENZHENCO
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