Splitting apparatus

Abstract

A splitting apparatus suitable to split a work piece along at least one cutting line formed on the work piece is provided. The splitting apparatus includes a chopper, a detector, a controller and an adjustor. The chopper is disposed above the work piece. The detector is disposed above the work piece for transmitting a signal to the work piece so as to get a specification data of the work piece. The controller connects the detector and receives the specification data and generates an adjustment data. The adjustor connects the controller and the chopper. The adjustor receives the adjustment data and adjusts a parameter data of the chopper according to the adjustment data so that the chopper splits the work piece for once along the cutting line formed on the work piece.

Description

technical field [0001] The present invention relates to a splitting device, and more particularly to a splitting device suitable for splitting a wafer. Background technique [0002] In the manufacturing process of LED wafers, there is a step of performing splitting operation to separate each wafer region in the wafer after cutting horizontal and vertical cutting lines by laser to form a plurality of independent LED wafers. In the prior art, most of the splitting operations are performed by using a splitting device. The wafer to be split is placed at a predetermined position under the wafer splitting device, and then the splitting knife seat is driven to descend, and then falls to a predetermined height. At this time, the splitting actuator is made to exert a force on the rivet, so that the rivet hits the predetermined position of the wafer and splits it. [0003] Since the wafer has a thinning process before cutting, the thickness of the wafer after the thinning process wil...

AI Technical Summary

Problems solved by technology

However, the splitting device applies the same splitting force to each dicing line of the wafer, which may not be able to split at one time, and requires a supplementary knife procedure

Although the splitting device is equipped with an image sensor, it can only know whether the wafer has been split to judge whether it is necessary to perform a tool repair program. That is to say, the splitting device cannot immediately know the status of the workpiece

In addition, after the knife repair procedure, problems such as discontinuous fracture, burr or peeling are likely to occur on the cut surface of the wafer, especially when the edge of the splitting knife is passivated, it may cause the wafer to be cut. The cutting surface is cracked and damaged, resulting in loss

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