A kind of glass substrate cutting equipment and cutting method

Abstract

The invention provides a glass substrate cutting apparatus, comprising workbenches, cutting knives and rollers, wherein a glass substrate is transferred on the workbenches; the cutting knives comprise an upper cutting knife and a lower cutting knife that are arranged the upper end and the lower end of the glass substrate respectively with knife edges opposite to each other, so as to cut the glass substrate into two halves from the upper side and the lower side of the glass substrate; the rollers are arranged at the upper end of the glass substrate; and the glass substrate can be pressed to break down along a cutting crack on the glass substrate. The cutting apparatus further comprises high-pressure nozzles that are arranged between the cutting knifes and the rollers and can eject a high-pressure airflow along the cutting crack so as to accelerate the breakage of the glass substrate.

Description

technical field [0001] The invention relates to a glass substrate manufacturing equipment and a preparation method, in particular to a glass substrate cutting equipment and a cutting method. Background technique [0002] In the manufacturing process of the existing liquid crystal panel, the glass substrate needs to be combined with a color filter, and the liquid crystal is poured on the substrate, and then cut into the required size. Usually, a cutting knife is used to cut the glass substrate back and forth to cut it into two halves. At this time, due to the long-term use of the cutting knife, the knife head is easy to wear and become blunt, and the cracks are shallow when cutting the glass, making it difficult to break. , affect the cutting quality of the glass substrate, and cannot meet the requirements of fine production of liquid crystal panels. Contents of the invention [0003] Based on the deficiencies of the prior art, the main purpose of the present invention is ...

AI Technical Summary

Problems solved by technology

Usually, a cutting knife is used to cut the glass substrate back and forth to cut it into two halves. At this time, due to the long-term use of the cutting knife, the knife head is easy to wear and become blunt, and the cracks are shallow when cutting the glass, making it difficult to break. , affects the cutting quality of the glass substrate, and cannot meet the requirements of fine production of LCD panels

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